| Kraemer, Daniel |
Germany |
FSP DE240320 603
|
Hardware Functional Safety Development
|
Apr 08, 2024
|
| Kraynik, Tim |
USA |
FSPUSA240119001
|
Machine Safety
|
Mar 12, 2024
|
| Krishna, Movva Siva |
India |
FSPIN 170615 009
|
Process
|
Jun 19, 2017
|
| Krishnaiyan, Ramu |
United Arab Emirates |
FSPME 230608 007
|
Process
|
Aug 23, 2023
|
| Krishnamurthi, Sriram |
Kuwait |
FSPME 191120 006
|
Process
|
Jan 28, 2020
|
| Krishnareddy, Mohan |
USA |
FSPUSA 180216 011
|
Automotive / Semiconductors
|
Feb 20, 2018
|
| Krishnaswami, Srini |
USA |
FSPUSA 191010 019
|
Automotive / Semiconductors
|
Oct 18, 2019
|
| Krishnaswamy, Rathinakumar |
Kuwait |
FSPME 191120 007
|
Process
|
Jan 28, 2020
|
| Krishnaswamy, Balaji |
Germany |
FSP DE220713 101
|
Automotive / Semiconductors
|
Aug 04, 2022
|
| Krivograd, Marko |
Germany |
FSP DE210408 601
|
Automotive
|
May 17, 2021
|
| Krolikowski, Dariusz |
USA |
FSPUSA 160825 002
|
Automotive
|
Sep 06, 2016
|
| Krones, Philipp |
Germany |
FSP DE230607 605
|
Automotive – Software
|
Jul 06, 2023
|
| Kroon, A |
Netherlands |
FSPNLD 240710 002
|
Process
|
Jul 26, 2024
|
| Kruger, Martin |
USA |
FSP USA231213022
|
Process
|
Jan 03, 2024
|
| Krull, Thomas |
Germany |
FSP 150611 002
|
Automotive
|
Jun 12, 2015
|
| Kruszec, Michal |
Poland |
FSPPOL 240614 007
|
Process
|
Jul 26, 2024
|
| Kshirsagar, Mangesh |
India |
FSPIN231012 001
|
Process
|
Nov 16, 2023
|
| KUAMR, Ajeet |
Singapore |
FSPSG 230526 005
|
Software Functional Safety Development
|
Oct 26, 2023
|
| Kuban, Robert |
Germany |
FSP DE221125 602
|
Automotive – Software
|
Mar 03, 2023
|
| Kuban, Marian |
Germany |
FSP DE240211 602
|
Automotive
|
Feb 26, 2024
|
| Kudruss, Manuel |
Germany |
FSP DE210318 601
|
Process
|
Apr 15, 2021
|
| Kuhnemuth, Daniel |
United Kingdom |
FSPUK 151119 005
|
Process
|
Feb 18, 2016
|
| Kühner, Richard |
Germany |
FSPDE 170629 009
|
Automotive
|
Jul 17, 2017
|
| Kulkarni , Vishal |
Germany |
FSPDE 171213 010
|
Automotive
|
Dec 21, 2017
|
| Kulkarni, Sumeet |
USA |
FSPUSA 230424 001
|
Automotive / Semiconductors
|
May 04, 2023
|
| Kumanlı , Çağlar |
Germany |
FSP DE220803 604
|
Process
|
Feb 08, 2023
|
| Kumar, Manish |
Germany |
FSP 150702 002
|
Safety Software Development
|
Jul 07, 2015
|
| Kumar, Rakesh |
India |
FSPIN191012006
|
Process
|
Oct 29, 2019
|
| Kumar, Anshul |
India |
FSPIN200123003
|
Process
|
Jan 27, 2020
|
| Kumar, Sudeep |
Saudi Arabia |
FSPKSA 110919 008
|
Process Hazard Analysis using HAZOP
|
Jan 28, 2020
|
| Kumar, Navin |
Australia |
FSPAU 211021 011
|
Automotive
|
Dec 22, 2021
|
| Kumar, Vinoth |
Germany |
FSP DE221020 612
|
Automotive – Software
|
Mar 03, 2023
|
| Kumar, Vinoth |
Germany |
FSp DE230120 607
|
Process
|
Mar 07, 2023
|
| Kumar, Chandan |
Germany |
FSP DE230619 602
|
Automotive – Software
|
Feb 27, 2024
|
| Kumar, Sarvesh |
USA |
FSPUSA231214010
|
SIL Verification with exSILentia
|
Mar 08, 2024
|
| Kumar K B, Rajesh |
India |
FSPIN200123007
|
Process
|
Jan 27, 2020
|
| Kumar P, Sachin |
India |
FSP DE230621 621
|
Automotive
|
Jul 18, 2023
|
| Kumaravel, Sumathy |
Ireland |
FSPIRL 190617 013
|
Automotive / Semiconductors
|
Jun 19, 2019
|
| Kumaresan, Vinod |
India |
FSPIN 180517 001
|
Process
|
May 22, 2018
|
| Kundwani, Manoj |
Germany |
FSP DE221020 602
|
Automotive – Software
|
Mar 03, 2023
|
| Kundwani, Manoj |
India |
FSP DE230303 604
|
Automotive – Software
|
Jul 06, 2023
|
| Kung, Yen-Chung |
Taiwan |
FSP TW170817 019
|
Process
|
Aug 25, 2017
|
| Kuo, Sam |
Taiwan |
FSPTW 221020 020
|
Automotive – Software
|
Nov 07, 2022
|
| Kurniadi, Bintang |
Singapore |
FSPSG 231026 006
|
Process
|
Nov 06, 2023
|
| Kushwaha, Rohit Kumar |
India |
FSPIN 190606 003
|
Process
|
Jun 10, 2019
|
| Kuykendal, Michelle |
USA |
FSPUSA 190425 005
|
Automotive
|
May 20, 2019
|
| Kwong, Phillip |
USA |
FSPUSA 191004 031
|
Automotive - Hardware
|
Oct 18, 2019
|
| Laarakker, Henry |
Canada |
FSPCAN 240401 006
|
Process
|
May 03, 2024
|
| Labaria, Yesser |
Germany |
FSP DE230607 601
|
Automotive – Software
|
Jul 06, 2023
|
| Labykin, Aleksei |
Russia |
FSPRU 210404 001
|
Process
|
Apr 06, 2021
|
| Lacan, Stephane |
Germany |
FSP DE210618 202
|
Automotive - Hardware
|
Jan 24, 2022
|
| Lack, Judith |
Germany |
FSPDE 180927 004
|
Automotive
|
Oct 12, 2018
|
| Lacsamana, Owen |
Singapore |
FSPSG 230826 008
|
Process
|
Sep 12, 2023
|
| Ladkaew, Nawaporn |
Thailand |
FSPTH 221026 003
|
Software Functional Safety Development
|
Oct 26, 2022
|
| Lafage, Benoit |
Germany |
FSP DE240411 1214
|
Automotive / Semiconductors
|
Aug 20, 2024
|
| LaFleur, Andrew |
USA |
FSPUSA 221103 010
|
Process
|
Nov 29, 2022
|
| Lagadec, Pierre-Axel |
Germany |
FSP DE240416 1205
|
Automotive / Semiconductors
|
Aug 20, 2024
|
| Lahori, Mukesh |
United Kingdom |
FSPGB 180110 017
|
Automotive / Semiconductors
|
Aug 30, 2019
|
| Lai, Yew Hong |
Singapore |
FSPSG 210826 005
|
Process
|
Aug 31, 2021
|
| Lakadawala, Muffadal |
USA |
FSPUSA 180216 017
|
Automotive / Semiconductors
|
Feb 20, 2018
|
| Lakhani, Samir |
USA |
FSPUSA 160915 006
|
Process
|
Sep 29, 2016
|
| Lal, MAdan |
India |
FSPIN220922002
|
Process
|
Oct 12, 2022
|
| Lala, Roberta |
Italy |
FSPIT 191024 039
|
Process
|
Dec 12, 2019
|
| Lam, Kevin |
United Kingdom |
FSPUK 210226 008
|
Process
|
Mar 16, 2021
|
| Lam, Jasmine |
Singapore |
FSPSG 240314 005
|
Process
|
Apr 09, 2024
|
| Lampert, Gilad |
Germany |
FSP DE220703 202
|
Automotive – Software
|
Aug 01, 2022
|
| Lan, Yuanfeng |
China |
FSPCN 221017-026
|
Automotive
|
Oct 27, 2022
|
| Lancaster, Travis |
United Kingdom |
FSPUK 211008 021
|
Process Industry Hardware acc. to IEC 61508
|
Oct 20, 2021
|
| Lancaster, Rose |
USA |
FSPUSA 230623 007
|
Functional Safety Development
|
Jul 19, 2023
|
| Landeros, David |
USA |
FSPUSA 171109 022
|
Process
|
Nov 15, 2017
|
| Landesman, Yotam |
Germany |
FSP DE230623 604
|
Automotive
|
Feb 07, 2024
|
| Landstorfer, Stefan |
Germany |
FSP DE210219 606
|
Automotive – Software
|
Mar 02, 2021
|
| Langford, Dylan |
United Kingdom |
FSPUK 161117 002
|
Process
|
Nov 22, 2016
|
| Langness, Jeff |
USA |
FSPUSA 170406 001
|
Automotive
|
Apr 13, 2017
|
| Lanier, Keith |
USA |
FSPUS 180119 007
|
Automotive / Semiconductors
|
Feb 09, 2018
|
| Lannin, Justin |
USA |
FSPUSA 220408 005
|
Process
|
Apr 14, 2022
|
| Lapuz, Carlin |
Australia |
FSPAU 211125 010
|
Machine Safety
|
Dec 01, 2021
|
| Lauria, Michele |
Italy |
FSPDE 200618 204
|
Automotive-HW
|
Jul 20, 2020
|
| Lauria, Michele |
Italy |
FSPDE 200618 204
|
Automotive-HW
|
Jul 27, 2020
|
| Lauridsen, Viktor |
Sweden |
FSPSWE 230517 003
|
Functional Safety Development
|
May 30, 2023
|
| Lausegger, Peter |
Germany |
FSP DE240902 602
|
Automotive
|
Oct 08, 2024
|
| Laveck, Nick |
Canada |
FSPCA 220324 003
|
Process
|
Apr 01, 2022
|
| Lavigueur, Bruno |
Canada |
FSP CA181025 007
|
Automotive / Semiconductors
|
Nov 06, 2018
|
| Law, Vincent |
Canada |
FSP CA181025 008
|
Automotive / Semiconductors
|
Nov 06, 2018
|
| Layer, Christophe |
France |
FSPFR 230317 002
|
Automotive / Semiconductors
|
Mar 27, 2023
|
| Lazar, Lucian |
Germany |
FSP DE211129 601
|
Automotive – Software
|
Jan 25, 2022
|
| Le Chauff de Kerguenec, Ael |
Germany |
FSP DE220622 111
|
Automotive / Semiconductors
|
Aug 01, 2022
|
| Le Gaspi, Jason |
USA |
FSPUSA 151210 007
|
Process
|
Dec 15, 2015
|
| Le Goffic, Laurent |
France |
FSP FR230713 103
|
Automotive / Semiconductors
|
Jul 26, 2023
|
| Le Quang, Khoa |
Singapore |
FSPSG 221208 004
|
Process
|
Dec 26, 2022
|
| Leahy, Brendan |
USA |
FSPUSA 210817 004
|
Automotive
|
Dec 10, 2021
|
| Leary, Ken |
USA |
FSPUSA 170608 002
|
Process
|
Jun 13, 2017
|
| Lebrun, Emile |
France |
FSP FR230713 106
|
Automotive / Semiconductors
|
Jul 26, 2023
|
| Lebrun, Anselme |
Germany |
FSP DE240411 1215
|
Automotive / Semiconductors
|
Aug 20, 2024
|
| Lechten, Bill |
USA |
FSPUS 171118 004
|
Automotive
|
Nov 27, 2017
|
| Leckett, Neil |
USA |
FSPUSA 180503 016
|
Automotive
|
May 14, 2018
|
| Lecler, Jean-Jacques |
Germany |
FSP DE220707 105
|
Automotive / Semiconductors
|
Aug 04, 2022
|
| Ledger, Adam |
United Kingdom |
FSPUK 180712 001
|
Process
|
Jul 13, 2018
|
| Lee, Chan |
USA |
FSPUSA 170609 001
|
Automotive / Semiconductors
|
Jun 14, 2017
|
| Lee, Gen-Ming |
Taiwan |
FSP TW170817 003
|
Process
|
Aug 25, 2017
|
| Lee, Chung-Lin |
Taiwan |
FSP TW170817 033
|
Process
|
Aug 25, 2017
|
| Lee, Chee |
USA |
FSPUSA 180322 004
|
Process
|
May 08, 2018
|
| Lee, YoungHwan |
Korea, South |
FSPKR 180619 004
|
Automotive / Semiconductors
|
Jul 03, 2018
|
| Lee, GyuHong |
Korea, South |
FSPKR 180619 008
|
Automotive / Semiconductors
|
Jul 03, 2018
|
| Lee, Charles |
United Kingdom |
FSPUK 181206 004
|
Process
|
Dec 17, 2018
|
| Lee, Lay Hoon |
Singapore |
FSPSG 210429 002
|
Software Functional Safety Development
|
Jun 01, 2021
|
| Lee, Desmond |
Singapore |
FSPSG 211105 011
|
Automotive
|
Nov 08, 2021
|
| Lee, Desmond |
Singapore |
FSPSNG 221027 001
|
Automotive / Semiconductors
|
Oct 27, 2022
|
| Lee, Charlie |
Taiwan |
FSPTW 221020 001
|
Automotive – Software
|
Nov 07, 2022
|
| Lee, Chris |
Australia |
FSPAU 221110 001
|
Machine Safety
|
Nov 24, 2022
|
| Lee, Sangyoon |
Singapore |
FSPSG 221216 008
|
SIL Verification with exSILentia
|
Dec 26, 2022
|
| Lee, Wenhwa |
Singapore |
FSPSG 221216 009
|
SIL Verification with exSILentia
|
Dec 26, 2022
|
| Lees, Matthew |
USA |
FSPUSA 240503 004
|
SIL Verification with exSILentia
|
May 31, 2024
|
| Lefler, William |
USA |
FSPUSA 180927 013
|
Process
|
Sep 28, 2018
|
| Legerstee, Thomas |
United Kingdom |
FSPUK 210924 008
|
Process
|
Sep 30, 2021
|
| Lehmann, Paul |
Australia |
FSPAU 210826 004
|
Machine Safety
|
Sep 06, 2021
|
| Lehner, Ralf |
Germany |
FSP DE221111 604
|
Automotive
|
Mar 02, 2023
|
| Lei, Tang |
China |
FSP 150923 009
|
Automotive
|
Sep 28, 2015
|
| Lei, Bu |
China |
FSPCN-220803-026
|
Automotive
|
Aug 03, 2022
|
| Leino, Matti |
Germany |
FSP DE240705 601
|
Software Functional Safety Development
|
Aug 21, 2024
|
| Leipold, James |
Australia |
FSPAU 221201 008
|
Machine Safety
|
Dec 07, 2022
|
| Leistad, Tor Erik |
Germany |
FSP DE220622 108
|
Automotive / Semiconductors
|
Aug 04, 2022
|
| Leite, Thiago |
Germany |
FSP DE220708 104
|
Automotive / Semiconductors
|
Aug 04, 2022
|
| Leite Cancio, Camila |
Brazil |
FSPBR 210518 005
|
Process
|
Oct 27, 2021
|
| Lele, Sneha |
USA |
FSPUSA 200715 001
|
Software Functional Safety Development
|
Jul 15, 2020
|
| Lemonakis, Pascal |
Germany |
FSPDE 180823 013
|
Automotive / Semiconductors
|
Aug 27, 2018
|
| Lentz, Nicholas |
USA |
FSPUSA 210512 001
|
Process
|
Jul 08, 2021
|
| Lenze, Felix |
Germany |
FSP DE210319 202
|
Automotive - Hardware
|
May 17, 2021
|
| Leonard, Dennis |
USA |
FSPUSA 230217 005
|
Machine Safety
|
Jun 30, 2023
|
| Leone, Ben |
Australia |
FSPAUS 230116 005
|
Process
|
Feb 06, 2023
|
| Leong, Vun |
Australia |
FSPAU 190919 004
|
Process
|
Nov 11, 2019
|
| Leong, Eng Chui Jade |
Germany |
FSP DE210708 201
|
Automotive - Hardware
|
Jan 25, 2022
|
| Leong, Sze Wan Louis |
Australia |
FSPAU 220811 002
|
Machine Safety
|
Aug 22, 2022
|
| Leontiiev, Kostiantyn |
Ukraine |
FSPUKR 241031 005
|
Functional Safety Development
|
Nov 21, 2024
|
| Leprevost, Xavier |
France |
FSP FR230713 113
|
Automotive / Semiconductors
|
Jul 26, 2023
|
| Lesniak, Bartosz |
Poland |
FSPPOL 240920 003
|
Process
|
Oct 15, 2024
|
| Levesque, Stephane |
Canada |
FSPCA 220428 004
|
Process
|
Jun 16, 2022
|
| Lewis, Andrew |
USA |
FSPUSA 170810 007
|
Process
|
Aug 30, 2017
|
| Lewis, Michael |
Canada |
FSP CA181025 001
|
Automotive / Semiconductors
|
Nov 06, 2018
|
| Lewis, Andrew |
Australia |
FSPAUS 22027 001
|
Machine Safety
|
Jun 17, 2022
|
| Lewis, Brett |
USA |
FSPUSA 230328 004
|
Process
|
Jun 06, 2023
|
| Leydiker, Alexander |
USA |
FSPUSA240119010
|
Machine Safety
|
Mar 28, 2024
|
| Li , Yang |
Germany |
FSP 150702 012
|
Safety Software Development
|
Jul 07, 2015
|
| Li, Di |
China |
FSPCN 160714 006
|
Process
|
Jul 21, 2016
|
| Li, Hong |
China |
FSPCN 161013 006
|
Process
|
Nov 07, 2016
|
| Li, George |
USA |
FSPUSA 170609 012
|
Automotive / Semiconductors
|
Jun 14, 2017
|
| Li, Alex |
USA |
FSPUSA 170609 017
|
Automotive / Semiconductors
|
Jun 14, 2017
|
| Li, Kai |
China |
FSPCN 171009 004
|
Automotive
|
Oct 10, 2017
|
| Li, Xinyu |
France |
FSPFR 180424 004
|
Automotive / Semiconductors
|
Apr 30, 2018
|
| Li, Changshan |
China |
FSPCN 180719 002
|
Process
|
Aug 03, 2018
|
| Li, Laury |
China |
FSPCN 181207 001
|
Automotive / Semiconductors
|
Dec 21, 2018
|
| Li, Lily |
China |
FSPCN 181207 011
|
Automotive / Semiconductors
|
Dec 21, 2018
|
| Li, Chao |
China |
FSPCN 181207 023
|
Automotive / Semiconductors
|
Dec 21, 2018
|
| Li, Claire |
China |
FSPCN 181207 024
|
Automotive / Semiconductors
|
Dec 21, 2018
|
| Li, Yuanjun |
China |
FSPCN 190221 009
|
Process
|
Mar 24, 2019
|
| Li, Li |
China |
FSPCN 190221 015
|
Process
|
Mar 24, 2019
|
| Li, Bangjun |
China |
FSPCN 190614 003
|
Process
|
Jun 17, 2019
|
| Li, Zhenhong |
USA |
FSPUSA 190606 003
|
Functional Safety Development
|
Jun 19, 2019
|
| Li, Weijun |
China |
FSP CN 211229 010
|
Automotive
|
Jan 11, 2022
|
| Li, Jat |
Germany |
FSP DE210611 603
|
Automotive
|
Jan 18, 2022
|
| Li, Alex |
China |
FSP DE210716 105
|
Automotive / Semiconductors
|
Jan 18, 2022
|
| Li, Zhensong |
China |
FSP CH211125 122
|
Automotive
|
May 10, 2022
|
| Li, Ruidong |
China |
FSPCN 221017-013
|
Automotive
|
Oct 27, 2022
|
| Li, Zhengzheng |
China |
FSPCN 220901 001
|
Automotive
|
Oct 27, 2022
|
| Li, Jingyong |
China |
FSPCN 220901 006
|
Automotive
|
Oct 27, 2022
|
| Li, Jiadong |
China |
FSPCN 220901 010
|
Automotive
|
Oct 27, 2022
|
| Li, Ke |
Germany |
FSP DE220726 605
|
Process
|
Nov 17, 2022
|
| Li, Leon |
China |
FSP-221208-007
|
Automotive
|
Dec 20, 2022
|
| LI, Jiaxin |
China |
FSP-221208-011
|
Automotive
|
Dec 20, 2022
|
| Li, Weiwei |
China |
FSP-221208-032
|
Automotive
|
Dec 20, 2022
|
| Li, Shan |
China |
FSP-221208-041
|
Automotive
|
Dec 20, 2022
|
| Li, Zhichong |
China |
FSP CH230906 901
|
Automotive / Semiconductors
|
Oct 02, 2023
|
| Li, Hongjie |
China |
FSP CN230906 903
|
Automotive / Semiconductors
|
Oct 02, 2023
|
| Li, Mingyang |
China |
FSP CN230906 908
|
Automotive / Semiconductors
|
Oct 02, 2023
|
| Li, Kaifu |
China |
FSP CN230809 907
|
Automotive / Semiconductors
|
Oct 02, 2023
|
| Li, Jie |
China |
FSP CN231222 901
|
Automotive / Semiconductors
|
Jan 15, 2024
|
| Li Wanzhou, Li |
China |
FSPCN-210722-008
|
Automotive
|
Aug 03, 2021
|
| Li-Hsiang, Chiu |
Singapore |
FSPSG 211008 001
|
Process Industry Hardware acc. to IEC 61508
|
Oct 20, 2021
|
| Liang, Yun-He |
Taiwan |
FSP TW170817 026
|
Process
|
Aug 25, 2017
|
| Liang, Richard |
USA |
FSPUSA 190606 004
|
Functional Safety Development
|
Jun 19, 2019
|
| Liang, Ziyang |
Australia |
FSPAU 220915 003
|
Machine Safety
|
Sep 19, 2022
|
| Liang, Yiling |
Australia |
FSPAUS 230824 007
|
Automotive
|
Sep 22, 2023
|
| Lianjun, Yao Lian |
China |
FSPCN 161013 007
|
Process
|
Nov 07, 2016
|
| Liao, Weicheng |
China |
FSP CN240528 908
|
Automotive / Semiconductors
|
Jun 21, 2024
|
| Liew, Clarence Keak Lian |
Singapore |
FSPSG 170720 004
|
Machine Safety
|
Jul 20, 2017
|
| Lim, Melvyn |
USA |
FSPUSA 170609 003
|
Automotive / Semiconductors
|
Jun 14, 2017
|
| Lim, Poey Chuan |
Singapore |
FSPSG 180405 003
|
Process
|
Apr 08, 2018
|
| Lim, Terence |
USA |
FSPUSA 190318 001
|
Process
|
Mar 20, 2019
|
| Lim, Qing Xian Jackson |
Singapore |
FSPSG 191010 007
|
Process
|
Oct 13, 2019
|
| Lim, Do Hwan |
South Korea |
FSPKOR 210208001
|
Process
|
May 13, 2021
|
| Lim, Boon Chong |
Singapore |
FSPSG 220630 003
|
Process
|
Dec 19, 2022
|
| Lim, Dickey |
Malaysia |
FSPMY 221216 003
|
Automotive – Software
|
Dec 26, 2022
|
| Lim, Chiat Joo |
Malaysia |
FSPMY 221216 005
|
Automotive – Software
|
Dec 26, 2022
|
| Lim, Chin Kuan Alan |
Singapore |
FSPSG 240328 003
|
Automotive
|
Apr 09, 2024
|
| Lim, Yunsong |
Singapore |
FSPSG 240328 004
|
Automotive
|
Apr 09, 2024
|
| Lim, Yee Sin |
Singapore |
FSPSG 240711 006
|
Process
|
Aug 14, 2024
|
| Limpanakorn, Narapat |
Thailand |
FSPTH 221026 001
|
Software Functional Safety Development
|
Oct 26, 2022
|
| Lin, Wei-Yan |
Taiwan |
FSP TW170817 013
|
Process
|
Aug 25, 2017
|
| Lin, Kao-Shou |
Taiwan |
FSP TW170817 031
|
Process
|
Aug 25, 2017
|
| Lin, Fan Guo |
China |
FSPCN 171009 021
|
Automotive
|
Oct 10, 2017
|
