Name | Exam Location | FSP Number | Specialty | Added |
---|---|---|---|---|
Lin, Yuan | Australia | FSPAU 190307 010 |
Machine Safety |
Mar 24, 2019 |
Lin, Shang-Han (Hank) | Australia | FSPAU 190307 011 |
Machine Safety |
Mar 24, 2019 |
Lin, YiLin | Singapore | FSPSG 220901 008 |
Process |
Sep 06, 2022 |
Lin, Zhou | China | FSPCN-230221-010 |
Automotive |
Mar 16, 2023 |
Lindeblad, Jonas | Sweden | FSPSWE 230517 012 |
Functional Safety Development |
Jun 02, 2023 |
Linzer, Larry | USA | FSP 150416 006 |
Process |
May 04, 2015 |
Lipovac, Amel | Germany | FSP DE220727 606 |
Process |
Nov 17, 2022 |
List , Ryan | USA | FSPUSA 210614 001 |
Functional Safety Development |
Jul 23, 2021 |
Litovtchenko, Vladimir | USA | FSPUSA 191010 013 |
Automotive / Semiconductors |
Oct 18, 2019 |
Litovtchenko, Vladimir | Germany | FSP DE210317 603 |
Process |
Apr 15, 2021 |
Littrell, Nate | USA | FSP 150924 007 |
Process |
Feb 18, 2016 |
Littrell, Xianwen | China | FSPCN 160414 004 |
Process |
Apr 27, 2016 |
Litwiniuk, Piotr | Germany | FSP DE210227 601 |
Automotive |
Mar 24, 2021 |
Liu, Changfu | China | FSP 151106 002 |
Automotive |
Nov 13, 2015 |
Liu, RongPeng | China | FSP 151106 019 |
Automotive |
Nov 13, 2015 |
Liu, Chaoshan | China | FSPCN 160414 007 |
Process |
Apr 27, 2016 |
Liu, Victor | China | FSPCN 160414 012 |
Process |
Apr 27, 2016 |
Liu, Baoyu | China | FSPCN 161013 003 |
Process |
Nov 07, 2016 |
Liu, Alex | China | FSPCN 170413 005 |
Process |
Apr 23, 2017 |
Liu, Tianwei | USA | FSPUSA 170609 040 |
Automotive / Semiconductors |
Jun 14, 2017 |
Liu, Hao-Hsuan | Taiwan | FSP TW170817 029 |
Process |
Aug 25, 2017 |
Liu, Wei | China | FSPCN 171009 002 |
Automotive |
Oct 10, 2017 |
Liu, Hongwei | China | FSPCN 171009 022 |
Automotive |
Oct 10, 2017 |
Liu, Liang | China | FSPCN 180322 013 |
Process |
Apr 23, 2018 |
Liu, Hao | USA | FSPUSA 180914 007 |
Automotive / Semiconductors |
Sep 21, 2018 |
Liu, Yuhua | USA | FSPUSA 190208 001 |
Process |
Feb 11, 2019 |
Liu, Hui | China | FSPCN 190221 003 |
Process |
Mar 24, 2019 |
Liu, Shucai | China | FSPCN 190221 014 |
Process |
Mar 24, 2019 |
Liu, Yu | China | FSPCN 191205 001 |
Process |
Dec 08, 2019 |
Liu, Li-Fan | Germany | FSP DE210306 603 |
Automotive – Software |
Apr 14, 2021 |
Liu, Zongyuan | China | FSPCN-210701 001 |
Automotive |
Jul 14, 2021 |
Liu, Lizhou | Singapore | FSPSG 210909 018 |
Process |
Sep 13, 2021 |
Liu, Xiang | China | FSP CN 211229 001 |
Automotive |
Jan 11, 2022 |
Liu, Dong | China | FSP CH211125 105 |
Automotive |
May 10, 2022 |
Liu, Jianming | China | FSPCN 221017-003 |
Automotive |
Oct 27, 2022 |
Liu, Qiang | China | FSPCN 221017-021 |
Automotive |
Oct 27, 2022 |
Liu, Fucheng | China | FSPCN 220930 002 |
Automotive |
Oct 27, 2022 |
Liu, Yuanfa | China | FSPCN 220901 004 |
Automotive |
Oct 27, 2022 |
Liu, James | Taiwan | FSPTW 221020 016 |
Automotive – Software |
Nov 07, 2022 |
Liu, Dongxu | China | FSPCN 221220 002 |
Hardware Functional Safety Development |
Dec 26, 2022 |
Liu, Monica | USA | FSPUSA231214008 |
SIL Verification with exSILentia |
Mar 11, 2024 |
Liu, Beng Hua | Singapore | FSPSG 240328 005 |
Automotive |
Apr 09, 2024 |
Liu, Yangchen | China | FSP CN240528 905 |
Automotive / Semiconductors |
Jun 21, 2024 |
Liu, Siu Fung | Singapore | FSPSG 240711 005 |
Process |
Aug 14, 2024 |
Liwei, Zhang | China | FSPCN-220803-036 |
Automotive |
Aug 03, 2022 |
LIZARRAGA TAZON, AITOR | Spain | FSPES 210504 024 |
Mechanical Functional Safety Development |
May 17, 2021 |
Lkhagva, Baasanbat | USA | FSPUSA 240113 010 |
Operations & Maintenance |
Jan 26, 2024 |
Lkhagvadorj, Naranbadral | Mongolia | FSPMN 210308 002 |
Process |
Apr 29, 2021 |
Lkhagvasuren, Ariunbold | Mongolia | FSPMNG 230308 006 |
Operations & Maintenance |
Mar 15, 2023 |
Lkhagvasuren, Sergelenbayar | Mongolia | FSPMNG 230308 020 |
Operations & Maintenance |
Mar 29, 2023 |
Lkhagvasuren, Sergelenbayar | Mongolia | FSPMNG 230308 020 |
Process |
May 12, 2023 |
Lkhagvasuren, Ariunbold | Mongolia | FSPMNG 230308 006 |
Process |
May 26, 2023 |
Lkhagvatseren, Munkhzorig | Mongolia | FSPMNG 230907 005 |
Process |
Oct 16, 2023 |
Llewellyn, David | USA | FSPUSA 160915 003 |
Process |
Sep 29, 2016 |
Lo, Jessica | USA | FSPUSA 170316 005 |
Process |
Apr 03, 2017 |
Lo, Kevin | Canada | FSPCAN 221011 001 |
Process |
Feb 06, 2023 |
Lobatyi, Viacheslav | Netherlands | FSPNL 211117 003 |
Process |
Nov 24, 2021 |
Lobo, Allan | USA | FSPUSA 180216 013 |
Automotive / Semiconductors |
Feb 20, 2018 |
Lock, Zachary | USA | FSPUSA 210318 004 |
SIL Verification with exSILentia |
Apr 16, 2021 |
Lock, Zachary | USA | FSPUSA 210318 004 |
SIL Verification with exSILentia |
Apr 22, 2021 |
Locke, D. Mark | USA | FSPME 160505 001 |
Process |
May 19, 2016 |
Lodha, Mahendra | USA | FSPUSA 170609 011 |
Automotive / Semiconductors |
Jun 14, 2017 |
Loeffler, Benjamin | Germany | FSP DE230316 802 |
Process |
Jul 06, 2023 |
Lofland, Eric | USA | FSPUSA 191024 001 |
Process |
Nov 06, 2019 |
Lofrumento, Claudio | Italy | FSPIT 191024 008 |
Process |
Dec 12, 2019 |
Loheac, Jean-Luc | Belgium | FSP DE200703 114 |
ISO 26262 Automotive / Semiconductors |
Aug 02, 2020 |
Lohinau, Aliaksandr | Germany | FSP DE210219 605 |
Automotive – Software |
Mar 02, 2021 |
Lohiya, Ramnarayan | Ireland | FSPIRL 190617 008 |
Automotive / Semiconductors |
Jun 19, 2019 |
Loison, JP | USA | FSPUSA 171130 025 |
Automotive / Semiconductors |
Dec 08, 2017 |
Lokhande, Harshal | India | FSPIN200123008 |
Process |
Jan 27, 2020 |
Lombardo, Davide | Italy | FSPIT 180504 005 |
Automotive |
Jul 02, 2018 |
Long, Laura | USA | FSPUSA 170609 022 |
Automotive / Semiconductors |
Jun 14, 2017 |
Long, Li | China | FSPCN-220803-040 |
Automotive |
Aug 03, 2022 |
Longar, Rok | Germany | FSP DE210323 301 |
Process |
Apr 14, 2021 |
Longar, Rok | Germany | FSP DE210323 301 |
Process |
Apr 20, 2021 |
LongLong, Iv | Germany | FSP DE210916 115 |
Automotive / Semiconductors |
Oct 07, 2021 |
Longwei , Zhang | China | FSPCN-210722-020 |
Automotive |
Aug 03, 2021 |
Loose, Tobias | Germany | FSPDE 180126 011 |
Automotive |
Jan 30, 2018 |
Lopez, Guillermo | Netherlands | FSPUK 230831 007 |
SIL Verification with exSILentia |
Sep 04, 2023 |
Lopez, Carlos | USA | FSPUSA 231017 001 |
Process |
Oct 26, 2023 |
Lopez Cambra, Julia | Germany | FSP DE220620 102 |
Automotive / Semiconductors |
Aug 04, 2022 |
Lopez Colon, Ricardo | USA | FSPUSA 151210 013 |
Process |
Dec 15, 2015 |
Lopez Tapia, Marcos VInicio | Ecuador | FSPECU 170608 007 |
Process |
Jun 14, 2017 |
Loranz, Steve | United Kingdom | FSPUK 220616 018 |
Automotive |
Jun 30, 2022 |
Lorenzini, Stefano | Italy | FSP DE210720 101 |
Automotive / Semiconductors |
Jan 18, 2022 |
Lorenzini, Stefano | Germany | FSP DE220219 601 |
Automotive – Software |
Mar 08, 2022 |
Lotake, Chinmay | USA | FSP US231109 011 |
Software Functional Safety Development |
Dec 06, 2023 |
Lotriet, Pieter | Mongolia | FSPMNG 230308 013 |
Operations & Maintenance |
Mar 23, 2023 |
Lotriet, Pieter | Mongolia | FSPMNG 230308 013 |
Process |
May 04, 2023 |
Lotz, Oliver | Germany | FSPDE 180823 019 |
Automotive / Semiconductors |
Aug 27, 2018 |
Lotz, Oliver | Germany | FSPDE 180823 019 |
Automotive / Semiconductors |
Aug 27, 2018 |
Louda, Martin | Germany | FSPDE 180823 017 |
Automotive / Semiconductors |
Aug 27, 2018 |
Low, Cheng Hong | Singapore | FSPSG 211105 003 |
Automotive |
Nov 14, 2021 |
Low, Kah Yi | Singapore | FSPSG 220901 004 |
Process |
Sep 06, 2022 |
Low, Chiz Yong | Singapore | FSPSG 231123 001 |
Process |
Dec 11, 2023 |
Low, Fu-Jun Timmy | Singapore | FSPSG 240328 006 |
Automotive |
Apr 09, 2024 |
Low, Wan Xuan | Australia | FSPAU 240530 012 |
Machine Safety |
Jun 10, 2024 |
Loyo, Martin | Mexico | FSPMEX 200923 004 |
Machine Safety |
Dec 22, 2021 |
LOYO FONSECA, MARTIN DANIEL | Mexico | FSPMEX 181004 005 |
Process |
Oct 12, 2018 |
Lu, Jih-Heng | Taiwan | FSP TW170817 023 |
Process |
Aug 25, 2017 |
Lu, Ning | China | FSPCN 171009 024 |
Automotive |
Oct 10, 2017 |
Lu, T.H. | USA | FSPUSA 191010 017 |
Automotive / Semiconductors |
Oct 18, 2019 |
Lu , Zhou | China | FSPCN-210722-021 |
Automotive |
Aug 03, 2021 |
Lu, Justin | Taiwan | FSPTW 221020 009 |
Automotive – Software |
Nov 07, 2022 |
Lu, Kevin | Australia | FSPAU 221201 005 |
Machine Safety |
Dec 11, 2022 |
Lu, Xiaoming | China | FSP CN230906 910 |
Automotive / Semiconductors |
Oct 02, 2023 |
Lu, Yonghao | Australia | FSPAUS 231023 006 |
Automotive |
Nov 14, 2023 |
Lu Guo, Dan | USA | FSPUSA 230404 002 |
Software Functional Safety Development |
Jun 09, 2023 |
Lucas, George | USA | FSPUSA 210614 006 |
Functional Safety Development |
Jul 23, 2021 |
Luck, Jerrold | Australia | FSPAUS 240308 004 |
Functional Safety Development |
Jun 20, 2024 |
Luff, Thomas | Germany | FSPDE 230922 001 |
Functional Safety Development |
Sep 26, 2023 |
Lui, Benghan | USA | FSPUSA 170609 005 |
Automotive / Semiconductors |
Jun 14, 2017 |
Lui, Barrie | United Kingdom | FSPUK 220616 007 |
Automotive |
Jun 30, 2022 |
Lukawski, Karol | USA | FSPUSA 200817 012 |
Functional Safety Development |
Aug 19, 2020 |
Lukensmeyer, Andrew | USA | FSPUSA 170309 010 |
Process |
Mar 24, 2017 |
Luna Ruiz, Omar | Mexico | FSPMEX 170615 002 |
Process |
Jul 25, 2017 |
Lunn Lassen, Jacob | Norway | FSP NO220422 105 |
Automotive / Semiconductors |
May 11, 2022 |
Luo, Xiaochuan | China | FSP CN240528 909 |
Automotive / Semiconductors |
Jun 21, 2024 |
Luongo, Giulio | Germany | FSP DE231208 302 |
Process Industry Hardware acc. to IEC 61508 |
Feb 07, 2024 |
Luongo, Giulio | Germany | FSP DE231208 602 |
Software Functional Safety Development |
Feb 07, 2024 |
Lupo, Francesco | USA | FSPUSA 191004 007 |
Automotive / Semiconductors |
Oct 18, 2019 |
Lupo, Francesco | USA | FSPUSA 191001 604 |
Automotive – Software |
Oct 18, 2019 |
Lupo , Ian | USA | FSPUSA 210614 004 |
Functional Safety Development |
Jul 23, 2021 |
Lutz, Christopher | USA | FSPUSA 180927 008 |
Process |
Nov 19, 2018 |
Luvsandorj, Khulan | Mongolia | FSPMN 220428 021 |
Process |
May 10, 2022 |
Luvsanpurev, Ganpurev | Mongolia | FSPMNG 230629 011 |
Process |
Aug 08, 2023 |
Luvsanpurev, Ganpurev | Mongolia | FSPMNG 230629 011 |
Operations & Maintenance |
Oct 16, 2023 |
Lv, Jie | China | FSPCN 221220 001 |
Hardware Functional Safety Development |
Dec 26, 2022 |
Lv, Donghuan | China | FSP CN240528 927 |
Automotive / Semiconductors |
Jun 21, 2024 |
LY, DIEU PHONG | Australia | FSPAU 240829 004 |
Machine Safety |
Sep 25, 2024 |
Lyson , Justyna | United Kingdom | FSPUK 170914 0007 |
Process |
Sep 15, 2017 |
M, Dineshbabu | India | FSPIN200917007 |
Process |
Sep 23, 2020 |
M. Dagheyam, Suleiman | Saudi Arabia | FSPKSA 180919 003 |
Process Hazard Analysis using HAZOP |
Jan 28, 2020 |
M. Ghamdi, Yaser | Saudi Arabia | FSPKSA 110919 009 |
Process Hazard Analysis using HAZOP |
Jan 28, 2020 |
Ma, Li | China | FSPCN 170413 002 |
Process |
Apr 23, 2017 |
Ma, Rui | USA | FSPUSA 170609 009 |
Automotive / Semiconductors |
Jun 14, 2017 |
Ma, Dennis | Canada | FSP CA181025 004 |
Automotive / Semiconductors |
Nov 06, 2018 |
Ma, Hongwei | China | FSPCN 181207 003 |
Automotive / Semiconductors |
Dec 21, 2018 |
Ma, Yunli | Singapore | FSPSG 181122 001 |
Process |
Mar 24, 2019 |
Ma, Wenjian | Singapore | FSPSG 210909 007 |
Process |
Sep 12, 2021 |
Ma, Yuliang | Singapore | FSPSG 210909 001 |
Process |
Sep 13, 2021 |
Ma, Lixin | United Kingdom | FSPUK 211008 013 |
Process Industry Hardware acc. to IEC 61508 |
Oct 22, 2021 |
Ma, Hongshun | China | FSP-221208-045 |
Automotive |
Dec 20, 2022 |
Mabrouk, Imed | Germany | FSP DE240411 1205 |
Automotive / Semiconductors |
Aug 20, 2024 |
Mabruk, Mustafa | United Kingdom | FSPUK 190314 006 |
Process |
Mar 22, 2019 |
Mabruk, Mustafa | United Kingdom | FSPUK 190314 006 |
Process |
Apr 03, 2019 |
MacDonald, Dominique | Australia | FSPAU 220721 004 |
Machine Safety |
Aug 01, 2022 |
MacFarlane, Donald | United Kingdom | FSPGB 180110 018 |
Automotive / Semiconductors Automation Cybersecurity |
Aug 30, 2019 |
Machado Cabello, Carlos | Peru | FSPPER 191212 002 |
Process |
Nov 24, 2020 |
Machuca Maldonado, Jorge Alex | Peru | FSPPER 181116 006 |
Process |
Jan 22, 2019 |
Mackaway, Allen | Australia | FSPAU 240906 002 |
Functional Safety Development |
Sep 25, 2024 |
Mackowiak, Aurelien | Germany | FSP DE221022 601 |
Automotive – Software |
Mar 03, 2023 |
Maclennan, Bruce | Canada | FSPCA 220324 007 |
Process |
Apr 01, 2022 |
MacMillan, Shaun | Canada | FSPCAN 170615 003 |
Process |
Jun 26, 2017 |
Madana, Jyothi kiran | India | FSP DE230620 607 |
Automotive – Software |
Jul 18, 2023 |
Madarapu, Bapiraju | Germany | FSP DE221020 610 |
Automotive – Software |
Mar 03, 2023 |
Madigan, Adele | Australia | FSPAU 230216 007 |
Process |
Mar 01, 2023 |
Madonna, Francesco | Italy | FSP IT210503 114 |
Automotive/Semiconductors |
May 18, 2021 |
Madonna, Francesco | Germany | FSP DE210507 607 |
Automotive – Software |
Jun 14, 2021 |
Magda, Rich | USA | FSPUSA 190606 005 |
Functional Safety Development |
Jun 19, 2019 |
Magdaniel, Victor | USA | FSPUSA 190919 008 |
Process |
Oct 10, 2019 |
Maggio, Filippo | Italy | FSP IT210503 105 |
Automotive/Semiconductors |
May 18, 2021 |
Maggio, Filippo | Germany | FSP DE210506 606 |
Automotive – Software |
Jun 14, 2021 |
Magnin, Marielle | USA | FSP USA 201211 005 |
Process |
Dec 11, 2020 |
Magrin, Franco | Germany | FSP 230710 406 |
Process Industry Hardware acc. to IEC 61508 |
Feb 06, 2024 |
Magrin, Franco | Germany | FSP DE1230711 608 |
Software Functional Safety Development |
Feb 06, 2024 |
Mahaarnichanon, Thanakorn | USA | FSPUSA 191203 101 |
Process |
Jun 16, 2020 |
Maharaj, Arvind | Australia | FSPAUS 240918 004 |
Functional Safety Development |
Nov 07, 2024 |
Mahesh, Harikumar | Singapore | FSPSG 191031 002 |
Functional Safety Development |
Nov 11, 2019 |
Maia, Andre | USA | FSPUSA 191010 014 |
Automotive / Semiconductors |
Oct 18, 2019 |
Maier , Christian | Germany | FSP 150702 009 |
Safety Software Development |
Jul 07, 2015 |
Maier, Michael | Germany | FSP DE240830 602 |
Automotive |
Oct 08, 2024 |
Maihua, Samuel | Papua New Guinea | FSPPG 230721 013 |
Process |
Aug 15, 2023 |
Maitra, Satyabrata | Germany | FSP DE220929 601 |
Automotive |
Jan 30, 2023 |
Majarikar, Sachin | India | FSPIN190124009 |
Process |
Sep 06, 2019 |
Majdalani Dalmaz, Manoela | Brazil | FSPBRA 210119 023 |
SIL Verification with exSILentia |
Mar 28, 2024 |
Majdalani Dalmaz, Manoela | Brazil | FSPBRA210119023 |
SIL Verification with exSILentia |
Apr 19, 2024 |
Majdalani Dalmaz, Manoela | Brazil | FSPBRA210119023 |
Process |
Apr 19, 2024 |
Majeed Sulaiman Al-Johani, Abdul | Saudi Arabia | FSPKSA 091019 011 |
Process Hazard Analysis using HAZOP |
Jan 28, 2020 |
Majipt Sebastin G, Majipt | Singapore | FSPSG 211008 005 |
Process Industry Hardware acc. to IEC 61508 |
Oct 19, 2021 |
Majowicz, Michal | Ireland | FSPIRL 190617 010 |
Automotive / Semiconductors |
Jun 19, 2019 |
Majumder, Atanu Ranjan | India | FSPIN220610 002 |
Process |
Aug 03, 2022 |
Maladkar, Poornima | India | FSPIN190208001 |
Process |
Sep 06, 2019 |
Malai, Natthaphon | Singapore | FSPSG 220915 005 |
Process |
Sep 30, 2022 |
Malam, Dewang | United Kingdom | FSPUK 180712 005 |
Process |
Jul 13, 2018 |
Maldonado, Edgar | USA | FSPUSA 220428 003 |
Functional Safety Development |
May 13, 2022 |
Malemutt, Pooja | Australia | FSPAUS 230824 008 |
Automotive |
Sep 22, 2023 |
Mallick, Sourangshu | Singapore | FSPSG 230824 004 |
Process |
Sep 12, 2023 |
Mallinger, Olivier | Germany | FSP DE220621 106 |
Automotive / Semiconductors |
Aug 04, 2022 |
Malvanker, Manthan | India | FSPIN191213004 |
Process |
Dec 18, 2019 |
Man, Dehu | China | FSP CN230328 903 |
Automotive / Semiconductors |
Apr 20, 2023 |
Manaljav, Tsendjav | Mongolia | FSPMN 210920 019 |
Process |
Sep 23, 2021 |
Manansala, Neo | USA | FSPUSA 240627 002 |
Process |
Jul 10, 2024 |
Mancastroppa, Alex | Italy | FSPITA 221101 001 |
SIL Verification with exSILentia |
Nov 23, 2022 |
Mandakh, Jamiyansharav | Mongolia | FSPMNG 240113 002 |
Operations & Maintenance |
Jan 31, 2024 |
Mandviwala, Aliasgar | USA | FSPUSA 191004 025 |
Automotive / Semiconductors |
Oct 18, 2019 |
Mangal, Rajesh | USA | FSP US231117 118 |
Automotive / Semiconductors |
Nov 27, 2023 |
Mangalapandian, Pragash | India | FSP DE230225 601 |
Automotive – Software |
Jul 06, 2023 |
Mangalore, Shrikantha | Germany | FSP DE221020 609 |
Automotive – Software |
Mar 03, 2023 |
Mangino, Umberto | Italy | FSP IT210503 118 |
Automotive/Semiconductors |
May 18, 2021 |