Lee, YoungHwan |
Korea, South |
FSPKR 180619 004
|
Automotive / Semiconductors
|
Jul 03, 2018
|
Lee, GyuHong |
Korea, South |
FSPKR 180619 008
|
Automotive / Semiconductors
|
Jul 03, 2018
|
Lee, Charles |
United Kingdom |
FSPUK 181206 004
|
Process
|
Dec 17, 2018
|
Lee, Lay Hoon |
Singapore |
FSPSG 210429 002
|
Software Functional Safety Development
|
Jun 01, 2021
|
Lee, Desmond |
Singapore |
FSPSG 211105 011
|
Automotive
|
Nov 08, 2021
|
Lee, Desmond |
Singapore |
FSPSNG 221027 001
|
Automotive / Semiconductors
|
Oct 27, 2022
|
Lee, Charlie |
Taiwan |
FSPTW 221020 001
|
Automotive – Software
|
Nov 07, 2022
|
Lee, Chris |
Australia |
FSPAU 221110 001
|
Machine Safety
|
Nov 24, 2022
|
Lee, Sangyoon |
Singapore |
FSPSG 221216 008
|
SIL Verification with exSILentia
|
Dec 26, 2022
|
Lee, Wenhwa |
Singapore |
FSPSG 221216 009
|
SIL Verification with exSILentia
|
Dec 26, 2022
|
Lee, Deborah (Chih-Ning) |
Germany |
FSP DE240805 601
|
Automotive – Software
|
Dec 11, 2024
|
Lees, Matthew |
USA |
FSPUSA 240503 004
|
SIL Verification with exSILentia
|
May 31, 2024
|
Lefler, William |
USA |
FSPUSA 180927 013
|
Process
|
Sep 28, 2018
|
Legerstee, Thomas |
United Kingdom |
FSPUK 210924 008
|
Process
|
Sep 30, 2021
|
Lehmann, Paul |
Australia |
FSPAU 210826 004
|
Machine Safety
|
Sep 06, 2021
|
Lehner, Ralf |
Germany |
FSP DE221111 604
|
Automotive
|
Mar 02, 2023
|
Lei, Tang |
China |
FSP 150923 009
|
Automotive
|
Sep 28, 2015
|
Lei, Bu |
China |
FSPCN-220803-026
|
Automotive
|
Aug 03, 2022
|
Leino, Matti |
Germany |
FSP DE240705 601
|
Software Functional Safety Development
|
Aug 21, 2024
|
Leipold, James |
Australia |
FSPAU 221201 008
|
Machine Safety
|
Dec 07, 2022
|
Leistad, Tor Erik |
Germany |
FSP DE220622 108
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Leitao, Ana Isabel |
Germany |
FSP DE241204 1201
|
Automotive / Semiconductors
|
Jan 09, 2025
|
Leite, Thiago |
Germany |
FSP DE220708 104
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Leite Cancio, Camila |
Brazil |
FSPBR 210518 005
|
Process
|
Oct 27, 2021
|
Lele, Sneha |
USA |
FSPUSA 200715 001
|
Software Functional Safety Development
|
Jul 15, 2020
|
Lemonakis, Pascal |
Germany |
FSPDE 180823 013
|
Automotive / Semiconductors
|
Aug 27, 2018
|
Lentz, Nicholas |
USA |
FSPUSA 210512 001
|
Process
|
Jul 08, 2021
|
Lenze, Felix |
Germany |
FSP DE210319 202
|
Automotive - Hardware
|
May 17, 2021
|
Leonard, Dennis |
USA |
FSPUSA 230217 005
|
Machine Safety
|
Jun 30, 2023
|
Leone, Ben |
Australia |
FSPAUS 230116 005
|
Process
|
Feb 06, 2023
|
Leong, Vun |
Australia |
FSPAU 190919 004
|
Process
|
Nov 11, 2019
|
Leong, Eng Chui Jade |
Germany |
FSP DE210708 201
|
Automotive - Hardware
|
Jan 25, 2022
|
Leong, Sze Wan Louis |
Australia |
FSPAU 220811 002
|
Machine Safety
|
Aug 22, 2022
|
Leontiiev, Kostiantyn |
Ukraine |
FSPUKR 241031 005
|
Functional Safety Development
|
Nov 21, 2024
|
Leprevost, Xavier |
France |
FSP FR230713 113
|
Automotive / Semiconductors
|
Jul 26, 2023
|
Lesniak, Bartosz |
Poland |
FSPPOL 240920 003
|
Process
|
Oct 15, 2024
|
Levesque, Stephane |
Canada |
FSPCA 220428 004
|
Process
|
Jun 16, 2022
|
Lewis, Andrew |
USA |
FSPUSA 170810 007
|
Process
|
Aug 30, 2017
|
Lewis, Michael |
Canada |
FSP CA181025 001
|
Automotive / Semiconductors
|
Nov 06, 2018
|
Lewis, Andrew |
Australia |
FSPAUS 22027 001
|
Machine Safety
|
Jun 17, 2022
|
Lewis, Brett |
USA |
FSPUSA 230328 004
|
Process
|
Jun 06, 2023
|
Leydiker, Alexander |
USA |
FSPUSA240119010
|
Machine Safety
|
Mar 28, 2024
|
Li , Yang |
Germany |
FSP 150702 012
|
Safety Software Development
|
Jul 07, 2015
|
Li, Di |
China |
FSPCN 160714 006
|
Process
|
Jul 21, 2016
|
Li, Hong |
China |
FSPCN 161013 006
|
Process
|
Nov 07, 2016
|
Li, George |
USA |
FSPUSA 170609 012
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Li, Alex |
USA |
FSPUSA 170609 017
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Li, Kai |
China |
FSPCN 171009 004
|
Automotive
|
Oct 10, 2017
|
Li, Xinyu |
France |
FSPFR 180424 004
|
Automotive / Semiconductors
|
Apr 30, 2018
|
Li, Changshan |
China |
FSPCN 180719 002
|
Process
|
Aug 03, 2018
|
Li, Laury |
China |
FSPCN 181207 001
|
Automotive / Semiconductors
|
Dec 21, 2018
|
Li, Lily |
China |
FSPCN 181207 011
|
Automotive / Semiconductors
|
Dec 21, 2018
|
Li, Chao |
China |
FSPCN 181207 023
|
Automotive / Semiconductors
|
Dec 21, 2018
|
Li, Claire |
China |
FSPCN 181207 024
|
Automotive / Semiconductors
|
Dec 21, 2018
|
Li, Yuanjun |
China |
FSPCN 190221 009
|
Process
|
Mar 24, 2019
|
Li, Li |
China |
FSPCN 190221 015
|
Process
|
Mar 24, 2019
|
Li, Bangjun |
China |
FSPCN 190614 003
|
Process
|
Jun 17, 2019
|
Li, Zhenhong |
USA |
FSPUSA 190606 003
|
Functional Safety Development
|
Jun 19, 2019
|
Li, Weijun |
China |
FSP CN 211229 010
|
Automotive
|
Jan 11, 2022
|
Li, Jat |
Germany |
FSP DE210611 603
|
Automotive
|
Jan 18, 2022
|
Li, Alex |
China |
FSP DE210716 105
|
Automotive / Semiconductors
|
Jan 18, 2022
|
Li, Zhensong |
China |
FSP CH211125 122
|
Automotive
|
May 10, 2022
|
Li, Ruidong |
China |
FSPCN 221017-013
|
Automotive
|
Oct 27, 2022
|
Li, Zhengzheng |
China |
FSPCN 220901 001
|
Automotive
|
Oct 27, 2022
|
Li, Jingyong |
China |
FSPCN 220901 006
|
Automotive
|
Oct 27, 2022
|
Li, Jiadong |
China |
FSPCN 220901 010
|
Automotive
|
Oct 27, 2022
|
Li, Ke |
Germany |
FSP DE220726 605
|
Process
|
Nov 17, 2022
|
Li, Leon |
China |
FSP-221208-007
|
Automotive
|
Dec 20, 2022
|
LI, Jiaxin |
China |
FSP-221208-011
|
Automotive
|
Dec 20, 2022
|
Li, Weiwei |
China |
FSP-221208-032
|
Automotive
|
Dec 20, 2022
|
Li, Shan |
China |
FSP-221208-041
|
Automotive
|
Dec 20, 2022
|
Li, Zhichong |
China |
FSP CH230906 901
|
Automotive / Semiconductors
|
Oct 02, 2023
|
Li, Hongjie |
China |
FSP CN230906 903
|
Automotive / Semiconductors
|
Oct 02, 2023
|
Li, Mingyang |
China |
FSP CN230906 908
|
Automotive / Semiconductors
|
Oct 02, 2023
|
Li, Kaifu |
China |
FSP CN230809 907
|
Automotive / Semiconductors
|
Oct 02, 2023
|
Li, Jie |
China |
FSP CN231222 901
|
Automotive / Semiconductors
|
Jan 15, 2024
|
Li, Xuyang |
China |
FSPCN-250114-007
|
Automotive
|
Jan 22, 2025
|
Li Wanzhou, Li |
China |
FSPCN-210722-008
|
Automotive
|
Aug 03, 2021
|
Li-Hsiang, Chiu |
Singapore |
FSPSG 211008 001
|
Process Industry Hardware acc. to IEC 61508
|
Oct 20, 2021
|
Liang, Yun-He |
Taiwan |
FSP TW170817 026
|
Process
|
Aug 25, 2017
|
Liang, Richard |
USA |
FSPUSA 190606 004
|
Functional Safety Development
|
Jun 19, 2019
|
Liang, Ziyang |
Australia |
FSPAU 220915 003
|
Machine Safety
|
Sep 19, 2022
|
Liang, Yiling |
Australia |
FSPAUS 230824 007
|
Automotive
|
Sep 22, 2023
|
Lianjun, Yao Lian |
China |
FSPCN 161013 007
|
Process
|
Nov 07, 2016
|
Liao, Weicheng |
China |
FSP CN240528 908
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Liew, Clarence Keak Lian |
Singapore |
FSPSG 170720 004
|
Machine Safety
|
Jul 20, 2017
|
Likhunova, Anastasiya |
Germany |
FSP DE240930 607
|
Process Hazard Analysis Using HAZOP
|
Dec 09, 2024
|
Likhunova, Anastasiya |
Germany |
FSP DE240926 601
|
Software Functional Safety Development
|
Dec 09, 2024
|
Lim, Melvyn |
USA |
FSPUSA 170609 003
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Lim, Poey Chuan |
Singapore |
FSPSG 180405 003
|
Process
|
Apr 08, 2018
|
Lim, Terence |
USA |
FSPUSA 190318 001
|
Process
|
Mar 20, 2019
|
Lim, Qing Xian Jackson |
Singapore |
FSPSG 191010 007
|
Process
|
Oct 13, 2019
|
Lim, Do Hwan |
South Korea |
FSPKOR 210208001
|
Process
|
May 13, 2021
|
Lim, Boon Chong |
Singapore |
FSPSG 220630 003
|
Process
|
Dec 19, 2022
|
Lim, Dickey |
Malaysia |
FSPMY 221216 003
|
Automotive – Software
|
Dec 26, 2022
|
Lim, Chiat Joo |
Malaysia |
FSPMY 221216 005
|
Automotive – Software
|
Dec 26, 2022
|
Lim, Chin Kuan Alan |
Singapore |
FSPSG 240328 003
|
Automotive
|
Apr 09, 2024
|
Lim, Yunsong |
Singapore |
FSPSG 240328 004
|
Automotive
|
Apr 09, 2024
|
Lim, Yee Sin |
Singapore |
FSPSG 240711 006
|
Process
|
Aug 14, 2024
|
Limpanakorn, Narapat |
Thailand |
FSPTH 221026 001
|
Software Functional Safety Development
|
Oct 26, 2022
|
Lin, Wei-Yan |
Taiwan |
FSP TW170817 013
|
Process
|
Aug 25, 2017
|
Lin, Kao-Shou |
Taiwan |
FSP TW170817 031
|
Process
|
Aug 25, 2017
|
Lin, Fan Guo |
China |
FSPCN 171009 021
|
Automotive
|
Oct 10, 2017
|
Lin, Yuan |
Australia |
FSPAU 190307 010
|
Machine Safety
|
Mar 24, 2019
|
Lin, Shang-Han (Hank) |
Australia |
FSPAU 190307 011
|
Machine Safety
|
Mar 24, 2019
|
Lin, YiLin |
Singapore |
FSPSG 220901 008
|
Process
|
Sep 06, 2022
|
Lin, Zhou |
China |
FSPCN-230221-010
|
Automotive
|
Mar 16, 2023
|
Lin , Alan (Hsu-Hsun) |
Germany |
FSP DE240730 602
|
Automotive – Software
|
Dec 11, 2024
|
Lin, Mars |
Germany |
FSP DE240730 603
|
Automotive – Software
|
Dec 11, 2024
|
Lindeblad, Jonas |
Sweden |
FSPSWE 230517 012
|
Functional Safety Development
|
Jun 02, 2023
|
Linzer, Larry |
USA |
FSP 150416 006
|
Process
|
May 04, 2015
|
Lipovac, Amel |
Germany |
FSP DE220727 606
|
Process
|
Nov 17, 2022
|
List , Ryan |
USA |
FSPUSA 210614 001
|
Functional Safety Development
|
Jul 23, 2021
|
Litovtchenko, Vladimir |
USA |
FSPUSA 191010 013
|
Automotive / Semiconductors
|
Oct 18, 2019
|
Litovtchenko, Vladimir |
Germany |
FSP DE210317 603
|
Process
|
Apr 15, 2021
|
Littrell, Nate |
USA |
FSP 150924 007
|
Process
|
Feb 18, 2016
|
Littrell, Xianwen |
China |
FSPCN 160414 004
|
Process
|
Apr 27, 2016
|
Litwiniuk, Piotr |
Germany |
FSP DE210227 601
|
Automotive
|
Mar 24, 2021
|
Liu, Changfu |
China |
FSP 151106 002
|
Automotive
|
Nov 13, 2015
|
Liu, RongPeng |
China |
FSP 151106 019
|
Automotive
|
Nov 13, 2015
|
Liu, Chaoshan |
China |
FSPCN 160414 007
|
Process
|
Apr 27, 2016
|
Liu, Victor |
China |
FSPCN 160414 012
|
Process
|
Apr 27, 2016
|
Liu, Baoyu |
China |
FSPCN 161013 003
|
Process
|
Nov 07, 2016
|
Liu, Alex |
China |
FSPCN 170413 005
|
Process
|
Apr 23, 2017
|
Liu, Tianwei |
USA |
FSPUSA 170609 040
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Liu, Hao-Hsuan |
Taiwan |
FSP TW170817 029
|
Process
|
Aug 25, 2017
|
Liu, Wei |
China |
FSPCN 171009 002
|
Automotive
|
Oct 10, 2017
|
Liu, Hongwei |
China |
FSPCN 171009 022
|
Automotive
|
Oct 10, 2017
|
Liu, Liang |
China |
FSPCN 180322 013
|
Process
|
Apr 23, 2018
|
Liu, Hao |
USA |
FSPUSA 180914 007
|
Automotive / Semiconductors
|
Sep 21, 2018
|
Liu, Yuhua |
USA |
FSPUSA 190208 001
|
Process
|
Feb 11, 2019
|
Liu, Hui |
China |
FSPCN 190221 003
|
Process
|
Mar 24, 2019
|
Liu, Shucai |
China |
FSPCN 190221 014
|
Process
|
Mar 24, 2019
|
Liu, Yu |
China |
FSPCN 191205 001
|
Process
|
Dec 08, 2019
|
Liu, Li-Fan |
Germany |
FSP DE210306 603
|
Automotive – Software
|
Apr 14, 2021
|
Liu, Zongyuan |
China |
FSPCN-210701 001
|
Automotive
|
Jul 14, 2021
|
Liu, Lizhou |
Singapore |
FSPSG 210909 018
|
Process
|
Sep 13, 2021
|
Liu, Xiang |
China |
FSP CN 211229 001
|
Automotive
|
Jan 11, 2022
|
Liu, Dong |
China |
FSP CH211125 105
|
Automotive
|
May 10, 2022
|
Liu, Jianming |
China |
FSPCN 221017-003
|
Automotive
|
Oct 27, 2022
|
Liu, Qiang |
China |
FSPCN 221017-021
|
Automotive
|
Oct 27, 2022
|
Liu, Fucheng |
China |
FSPCN 220930 002
|
Automotive
|
Oct 27, 2022
|
Liu, Yuanfa |
China |
FSPCN 220901 004
|
Automotive
|
Oct 27, 2022
|
Liu, James |
Taiwan |
FSPTW 221020 016
|
Automotive – Software
|
Nov 07, 2022
|
Liu, Dongxu |
China |
FSPCN 221220 002
|
Hardware Functional Safety Development
|
Dec 26, 2022
|
Liu, Monica |
USA |
FSPUSA231214008
|
SIL Verification with exSILentia
|
Mar 11, 2024
|
Liu, Beng Hua |
Singapore |
FSPSG 240328 005
|
Automotive
|
Apr 09, 2024
|
Liu, Yangchen |
China |
FSP CN240528 905
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Liu, Siu Fung |
Singapore |
FSPSG 240711 005
|
Process
|
Aug 14, 2024
|
Liwei, Zhang |
China |
FSPCN-220803-036
|
Automotive
|
Aug 03, 2022
|
LIZARRAGA TAZON, AITOR |
Spain |
FSPES 210504 024
|
Mechanical Functional Safety Development
|
May 17, 2021
|
Lkhagva, Baasanbat |
USA |
FSPUSA 240113 010
|
Operations & Maintenance
|
Jan 26, 2024
|
Lkhagvadorj, Naranbadral |
Mongolia |
FSPMN 210308 002
|
Process
|
Apr 29, 2021
|
Lkhagvasuren, Ariunbold |
Mongolia |
FSPMNG 230308 006
|
Operations & Maintenance
|
Mar 15, 2023
|
Lkhagvasuren, Sergelenbayar |
Mongolia |
FSPMNG 230308 020
|
Operations & Maintenance
|
Mar 29, 2023
|
Lkhagvasuren, Sergelenbayar |
Mongolia |
FSPMNG 230308 020
|
Process
|
May 12, 2023
|
Lkhagvasuren, Ariunbold |
Mongolia |
FSPMNG 230308 006
|
Process
|
May 26, 2023
|
Lkhagvatseren, Munkhzorig |
Mongolia |
FSPMNG 230907 005
|
Process
|
Oct 16, 2023
|
Llewellyn, David |
USA |
FSPUSA 160915 003
|
Process
|
Sep 29, 2016
|
Lo, Jessica |
USA |
FSPUSA 170316 005
|
Process
|
Apr 03, 2017
|
Lo, Kevin |
Canada |
FSPCAN 221011 001
|
Process
|
Feb 06, 2023
|
Lobatyi, Viacheslav |
Netherlands |
FSPNL 211117 003
|
Process
|
Nov 24, 2021
|
Lobo, Allan |
USA |
FSPUSA 180216 013
|
Automotive / Semiconductors
|
Feb 20, 2018
|
Lock, Zachary |
USA |
FSPUSA 210318 004
|
SIL Verification with exSILentia
|
Apr 16, 2021
|
Lock, Zachary |
USA |
FSPUSA 210318 004
|
SIL Verification with exSILentia
|
Apr 22, 2021
|
Locke, D. Mark |
USA |
FSPME 160505 001
|
Process
|
May 19, 2016
|
Lodha, Mahendra |
USA |
FSPUSA 170609 011
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Loeffler, Benjamin |
Germany |
FSP DE230316 802
|
Process
|
Jul 06, 2023
|
Lofland, Eric |
USA |
FSPUSA 191024 001
|
Process
|
Nov 06, 2019
|
Lofrumento, Claudio |
Italy |
FSPIT 191024 008
|
Process
|
Dec 12, 2019
|
Loheac, Jean-Luc |
Belgium |
FSP DE200703 114
|
ISO 26262 Automotive / Semiconductors
|
Aug 02, 2020
|
Lohinau, Aliaksandr |
Germany |
FSP DE210219 605
|
Automotive – Software
|
Mar 02, 2021
|
Lohiya, Ramnarayan |
Ireland |
FSPIRL 190617 008
|
Automotive / Semiconductors
|
Jun 19, 2019
|
Loison, JP |
USA |
FSPUSA 171130 025
|
Automotive / Semiconductors
|
Dec 08, 2017
|
Lokhande, Harshal |
India |
FSPIN200123008
|
Process
|
Jan 27, 2020
|
Lombardi, Agostino |
Germany |
FSP DE240902 609
|
Automotive – Software
|
Dec 12, 2024
|
Lombardo, Davide |
Italy |
FSPIT 180504 005
|
Automotive
|
Jul 02, 2018
|
Long, Laura |
USA |
FSPUSA 170609 022
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Long, Li |
China |
FSPCN-220803-040
|
Automotive
|
Aug 03, 2022
|
Longar, Rok |
Germany |
FSP DE210323 301
|
Process
|
Apr 14, 2021
|
Longar, Rok |
Germany |
FSP DE210323 301
|
Process
|
Apr 20, 2021
|
LongLong, Iv |
Germany |
FSP DE210916 115
|
Automotive / Semiconductors
|
Oct 07, 2021
|
Longwei , Zhang |
China |
FSPCN-210722-020
|
Automotive
|
Aug 03, 2021
|
Loose, Tobias |
Germany |
FSPDE 180126 011
|
Automotive
|
Jan 30, 2018
|
Lopez, Guillermo |
Netherlands |
FSPUK 230831 007
|
SIL Verification with exSILentia
|
Sep 04, 2023
|
Lopez, Carlos |
USA |
FSPUSA 231017 001
|
Process
|
Oct 26, 2023
|
Lopez Cambra, Julia |
Germany |
FSP DE220620 102
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Lopez Colon, Ricardo |
USA |
FSPUSA 151210 013
|
Process
|
Dec 15, 2015
|
Lopez Tapia, Marcos VInicio |
Ecuador |
FSPECU 170608 007
|
Process
|
Jun 14, 2017
|
Loranz, Steve |
United Kingdom |
FSPUK 220616 018
|
Automotive
|
Jun 30, 2022
|
Lorenzini, Stefano |
Italy |
FSP DE210720 101
|
Automotive / Semiconductors
|
Jan 18, 2022
|
Lorenzini, Stefano |
Germany |
FSP DE220219 601
|
Automotive – Software
|
Mar 08, 2022
|
Lotake, Chinmay |
USA |
FSP US231109 011
|
Software Functional Safety Development
|
Dec 06, 2023
|
Lotriet, Pieter |
Mongolia |
FSPMNG 230308 013
|
Operations & Maintenance
|
Mar 23, 2023
|
Lotriet, Pieter |
Mongolia |
FSPMNG 230308 013
|
Process
|
May 04, 2023
|
Lotz, Oliver |
Germany |
FSPDE 180823 019
|
Automotive / Semiconductors
|
Aug 27, 2018
|
Lotz, Oliver |
Germany |
FSPDE 180823 019
|
Automotive / Semiconductors
|
Aug 27, 2018
|
Louda, Martin |
Germany |
FSPDE 180823 017
|
Automotive / Semiconductors
|
Aug 27, 2018
|
Low, Cheng Hong |
Singapore |
FSPSG 211105 003
|
Automotive
|
Nov 14, 2021
|
Low, Kah Yi |
Singapore |
FSPSG 220901 004
|
Process
|
Sep 06, 2022
|