Tack, Jacon |
United Kingdom |
FSPUK 210625 005
|
Process
|
Jul 21, 2021
|
Tadros, Roudelf |
Singapore |
FSPSG 240314 004
|
Process
|
Apr 09, 2024
|
Tahara, Shinsuke |
Singapore |
FSPSG 240510 004
|
Automotive – Software
|
May 16, 2024
|
Takait, Laila |
Germany |
FSP DE220621 104
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Takata , Ryotaro |
Belgium |
FSP DE200703 116
|
ISO 26262 Automotive / Semiconductors
|
Aug 02, 2020
|
Takyrbashev, Daniiar |
USA |
FSPUSA 180216 020
|
Automotive / Semiconductors
|
Feb 20, 2018
|
Talbot, Michael |
USA |
FSP 150611 005
|
Process
|
Oct 03, 2016
|
Taleb AlAttas, Mohamed |
UAE |
FSPME 191106 014
|
Process
|
Jan 28, 2020
|
Talib, Mohammad Abdul Adib |
Singapore |
FSPSG 211118 008
|
Process
|
Nov 29, 2021
|
Tallon, Timothy |
USA |
FSPUSA 210127 009
|
Process
|
Jan 31, 2022
|
Talluto, Salvatore |
USA |
FSPUS 180119 012
|
Automotive / Semiconductors
|
Feb 09, 2018
|
Tamseel, Muhammad |
USA |
FSPUSA 191206 101
|
Process
|
Jun 16, 2020
|
Tan, Kien Beng |
Italy |
FSPIT 180504 008
|
Automotive
|
Jul 02, 2018
|
Tan, Jessica |
Singapore |
FSPSG 190314 001
|
Process
|
Mar 24, 2019
|
Tan, Cheau Kim |
Singapore |
FSPSG 190730 005
|
Process Hazard Analysis Using HAZOP
|
Aug 07, 2019
|
Tan, Chee Yong |
United Kingdom |
FSPUK 191004 003
|
Process
|
Oct 24, 2019
|
Tan, Shi Yun Jessica |
Singapore |
FSPSG 220901 001
|
Process
|
Sep 06, 2022
|
Tan, Chwan Hwang |
Singapore |
FSPSG 221208 001
|
Process
|
Dec 26, 2022
|
Tan, Shin Yi |
Malaysia |
FSPMY 221216 006
|
Automotive – Software
|
Dec 26, 2022
|
Tan, Puay Hong |
Singapore |
FSPSG 240328 007
|
Automotive
|
Apr 09, 2024
|
Tanduo, Luca |
Italy |
FSPIT 180504 011
|
Automotive
|
Jul 02, 2018
|
Tang, Yifei |
China |
FSP 151106 004
|
Automotive
|
Nov 13, 2015
|
Tang, Spencer |
China |
FSP 151106 006
|
Automotive
|
Nov 13, 2015
|
Tang, Monica |
USA |
FSPUSA 171130 005
|
Automotive / Semiconductors
|
Dec 08, 2017
|
Tang, Yuyi |
Germany |
FSPDE 180420 005
|
Automotive / Semiconductors
|
Apr 30, 2018
|
Tang, Fee Boon |
USA |
FSPUSA 190823 001
|
Process
|
Aug 26, 2019
|
Tang, Alan Cheuk Lun |
Singapore |
FSPSG 210429 003
|
Software Functional Safety Development
|
Apr 30, 2021
|
Tang, Hua |
USA |
FSPUSA 230518 013
|
Automotive / Semiconductors
|
May 24, 2023
|
Tang, Kylie |
Australia |
FSPAU 230920 004
|
Functional Safety Development
|
Oct 09, 2023
|
Tang, Zirui |
China |
FSP CN240528 923
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Tang, Xiaodan |
China |
FSP CN240528 929
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Tangadpalliwar, Snehal |
Australia |
FSPAU 211021 005
|
Automotive
|
Feb 01, 2022
|
Tański , Piotr |
Germany |
FSP DE161214 002
|
Automotive
|
Jan 30, 2017
|
Tanski, Piotr |
Germany |
FSP DE220317 601
|
Process
|
Apr 22, 2022
|
Tao, Wang |
China |
FSP 151106 010
|
Automotive
|
Nov 13, 2015
|
Tao, Li |
USA |
FSPUSA 180914 012
|
Automotive / Semiconductors
|
Sep 21, 2018
|
Tao, Xiong |
China |
FSP DE210717 102
|
Automotive / Semiconductors
|
Jan 18, 2022
|
Tao, Aoyun |
China |
FSP CN240528 906
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Tapase, Suraj |
USA |
FSP US231109 019
|
Software Functional Safety Development
|
Dec 06, 2023
|
Taquie, Faisal |
USA |
FSPUSA 160824 004
|
Automotive
|
Sep 06, 2016
|
Tariq Al-Ibrahim, Mohammed |
Saudi Arabia |
FSPKSA 180919 004
|
Process Hazard Analysis using HAZOP
|
Jan 28, 2020
|
Taryono, Ono |
Singapore |
FSPSG 200910 007
|
Process
|
Sep 14, 2020
|
Taschwer, Christoph |
Germany |
FSP DE231119 601
|
Automotive
|
Feb 07, 2024
|
Tata, Jagati |
United Kingdom |
FSPUK 220210 008
|
Functional Safety Development
|
Mar 07, 2022
|
Tauber, Marco |
Germany |
FSP DE201126 202
|
Automotive - Hardware
|
Jan 25, 2021
|
Tawfek, Hany |
Egypt |
FSPME 191218 011
|
Process
|
Jan 28, 2020
|
Tawfik, Kamal |
Ireland |
FSPIRL 240402 004
|
Automotive
|
Jun 20, 2024
|
Tawney , Terrah |
USA |
FSPUSA 210516 004
|
Process
|
Jun 08, 2021
|
Tawney, Terrah |
USA |
FSPUSA 210516 004
|
SIL Verification with exSILentia
|
Mar 11, 2024
|
Tayal, Sumit |
USA |
FSPUS 171118 011
|
Automotive
|
Nov 27, 2017
|
Tayebi, Hooman |
Germany |
FSP DE210408 603
|
Automotive
|
May 17, 2021
|
Tayel, Ehab |
USA |
FSPUSA 181206 005
|
Process
|
Dec 17, 2018
|
Taylor, David |
USA |
FSP 150416 010
|
Process
|
May 04, 2015
|
Taylor, Robert |
USA |
FSPUSA 161215 002
|
Process
|
Dec 20, 2016
|
Taylor, Brent |
Canada |
FSP CA181025 029
|
Automotive / Semiconductors
|
Nov 06, 2018
|
Taylor, Brian |
USA |
FSPUSA 200428 101
|
Process
|
Jun 16, 2020
|
Taylor , Steven |
USA |
FSP USA 210107 001
|
Process
|
Jan 08, 2021
|
Tchoufack Teuffo, Arnaud |
Germany |
FSPDE 201015 601
|
Automotive
|
Oct 19, 2020
|
Tchoufack Teuffo, Arnaud |
Germany |
FSP DE201015 601
|
Automotive
|
Dec 11, 2020
|
Teasdale, Brent |
Singapore |
FSPSG 211118 005
|
Process
|
Nov 23, 2021
|
Tee, Erwin |
Australia |
FSPAU 221110 005
|
Machine Safety
|
Nov 24, 2022
|
Teke, Cem |
Germany |
FSP DE200925 603
|
Automotive
|
Dec 11, 2020
|
Tektaş , Musa |
Germany |
FSP DE220802 606
|
Process
|
Feb 08, 2023
|
Tempelhagen , Thilo |
Germany |
FSPDE 171213 009
|
Automotive
|
Dec 21, 2017
|
Tempero, David |
Germany |
FSP DE220325 606
|
Automotive – Software
|
Apr 20, 2022
|
Teng, Jichao |
China |
FSPCN 171009 020
|
Automotive
|
Oct 10, 2017
|
Tengda, Wang |
China |
FSPCN-210716-006
|
Automotive
|
Aug 03, 2021
|
Teperek, Robbie |
United Kingdom |
FSPUK 210326 002
|
SIL Verification with exSILentia
|
Mar 31, 2021
|
Terrell, Daniel |
USA |
FSPUSA 240503 003
|
SIL Verification with exSILentia
|
May 13, 2024
|
Terreran, Mauro |
Germany |
FSP DE230711 401
|
Process Industry Hardware acc. to IEC 61508
|
Feb 06, 2024
|
Terreran, Mauro |
Germany |
FSP DE230711 601
|
Software Functional Safety Development
|
Feb 06, 2024
|
Tey, Siu Lee |
Singapore |
FSPSG 190314 003
|
Process
|
Mar 24, 2019
|
Teyssier, Melanie |
United Kingdom |
FSPGB 180110 003
|
Automotive / Semiconductors
|
Aug 30, 2019
|
Thacker, Hiren |
India |
FSPIN180809004
|
Process
|
Aug 13, 2018
|
Thaiparambath, Bijesh |
India |
FSPIND 240320 003
|
Functional Safety Development
|
Jun 20, 2024
|
Thalabaktula, Vikas |
India |
FSP DE230302 603
|
Automotive – Software
|
Jul 06, 2023
|
Tham, Carmen |
Malaysia |
FSPMY 221216 002
|
Automotive – Software
|
Dec 26, 2022
|
Thampy, Praveen John |
Australia |
FSPAU 240829 005
|
Machine Safety
|
Sep 25, 2024
|
Thati, Samanth |
India |
FSPIN191213002
|
Process
|
Dec 18, 2019
|
Thawani , Lokesh |
Germany |
FSPDE 171213 001
|
Automotive
|
Dec 21, 2017
|
Thebeau, Ronnie |
USA |
FSPUSA 190606 016
|
Functional Safety Development
|
Jun 19, 2019
|
Therene, Christophe |
Germany |
FSP DE210411 603
|
Automotive – Software
|
May 17, 2021
|
Thexton, Bryan |
Canada |
FSP CA181025 019
|
Automotive / Semiconductors
|
Nov 06, 2018
|
Thi Ha, Win |
Singapore |
FSPSG 221020 004
|
Process
|
Oct 27, 2022
|
Thiagarajan, Kumaravel |
India |
FSP DE230302 605
|
Automotive – Software
|
Jul 06, 2023
|
Thiella, Paolo |
Germany |
FSP DE230710 405
|
Process Industry Hardware acc. to IEC 61508
|
Feb 06, 2024
|
Thiella, Paolo |
Germany |
FSP DE230711 603
|
Software Functional Safety Development
|
Feb 06, 2024
|
Thillaisabapathy, Manivasagam |
India |
FSPIN190124002
|
Process
|
Sep 06, 2019
|
Thiry , Olivier |
Belgium |
FSP DE200703 103
|
ISO 26262 Automotive / Semiconductors
|
Aug 02, 2020
|
Thivin, Mathieu |
Germany |
FSP DE210525 202
|
Automotive - Hardware
|
Jun 11, 2021
|
Thomas, Marius |
Germany |
FSP DE240320 602
|
Software Functional Safety Development
|
Apr 08, 2024
|
Thombre, Vishal |
Singapore |
FSPSG 181122 002
|
Process
|
Mar 24, 2019
|
Thompson, Chris |
Germany |
FSP DE220622 110
|
Automotive / Semiconductors
|
Aug 01, 2022
|
Thummar, Jagdishkumar Balubhai |
Germany |
FSP DE221020 622
|
Automotive – Software
|
Mar 03, 2023
|
Thuraiswamy, Jegan Babu |
USA |
FSPUSA 180322 007
|
Process
|
May 08, 2018
|
Tianliang, Wang |
China |
FSPCN-210716-003
|
Automotive
|
Aug 03, 2021
|
Tilal Hasan, Syed |
United Arab Emirates |
FSPME 230608 003
|
Process
|
Aug 23, 2023
|
Tim, John |
USA |
FSPUSA 170209 001
|
Process
|
Feb 15, 2017
|
Tinaburri, Alberto |
Italy |
FSPIT 191024 028
|
Process
|
Dec 12, 2019
|
Tingting, Yang |
China |
FSPCN-220803-019
|
Automotive
|
Aug 03, 2022
|
Tipi, Kaan |
Germany |
FSP DE220802 603
|
Process
|
Feb 08, 2023
|
Tiwari, Sobhit |
India |
FSPIN230209 006
|
Process
|
Mar 28, 2023
|
Tiziani, Federico |
USA |
FSPUSA 191004 021
|
Automotive / Semiconductors
|
Oct 18, 2019
|
Tiziani, Federico |
USA |
FSPUSA 191001 603
|
Automotive – Software
|
Oct 18, 2019
|
Tobileri Bielo, Alexis |
USA |
FSPUSA 221128 007
|
Process
|
Feb 06, 2023
|
Todorović, Dušan |
Germany |
FSPDE 190822 601
|
Automotive – Software
|
Oct 15, 2019
|
Tokito , Shunsaku |
Belgium |
FSP DE200703 115
|
ISO 26262 Automotive / Semiconductors
|
Aug 02, 2020
|
Tolcher, Gregory |
USA |
FSPUK 231227 002
|
Software Functional Safety Development
|
Mar 11, 2024
|
Toledano, Ron |
Germany |
FSP DE200528 103
|
Automotive/Semiconductors
|
Jun 03, 2020
|
Tom Keogh, Tom Keogh |
United Kingdom |
FSPUK 190314 009
|
Process
|
Apr 03, 2019
|
Tomas, Luis |
Ireland |
FSPIRL 190617 028
|
Automotive / Semiconductors
|
Jun 19, 2019
|
Tomlinson, Wade |
USA |
FSPUS 171118 003
|
Automotive
|
Nov 27, 2017
|
Ton, That |
USA |
FSPUSA 220408 006
|
Process
|
Apr 14, 2022
|
Toner , Ciaran |
Germany |
FSPDE 170427 001
|
Process
|
May 03, 2017
|
Tong, Hongjian |
China |
FSPCN 160927 001
|
Automotive
|
Nov 29, 2016
|
Tong, Xin |
United Kingdom |
FSPUK 220210 017
|
Functional Safety Development
|
Mar 07, 2022
|
Tong, Chuck |
USA |
FSP US231117 111
|
Automotive / Semiconductors
|
Nov 27, 2023
|
Tongxin, Mu |
China |
FSPCN-230221-019
|
Automotive
|
Mar 16, 2023
|
Tony, Tony |
Shanghai |
FSP CN220326 004
|
Automotive / Semiconductors
|
Apr 09, 2021
|
Toofanny, Hasif |
Germany |
FSPDEU240112001
|
Automotive
|
Mar 28, 2024
|
Torgerson, David |
USA |
FSPUSA 170406 003
|
Automotive
|
Apr 13, 2017
|
Torraville, Michael |
USA |
FSPUSA 221209 006
|
Process
|
Dec 13, 2022
|
Torres, James |
USA |
FSPUSA 160421 004
|
Process
|
Apr 27, 2016
|
Torres, Salvador |
USA |
FSPUSA 230928 009
|
Process
|
Oct 02, 2023
|
Torres Juárez, Joel |
Mexico |
FSPMEX 170928 008
|
Process
|
Oct 10, 2017
|
Tougas, Michael |
Australia |
FSPAU 190619 005
|
Machine Safety
|
Jul 01, 2019
|
Tournie, Sebastien |
Germany |
FSP DE240412 1201
|
Automotive / Semiconductors
|
Aug 20, 2024
|
Townley, Scott |
USA |
FSPUSA 171109 013
|
Process
|
Nov 15, 2017
|
Tran, Uyen |
USA |
FSP US231117 115
|
Automotive / Semiconductors
|
Nov 27, 2023
|
Trautner, Sandra |
Germany |
FSP DE220403 601
|
Automotive – Software
|
Apr 20, 2022
|
Traversier, Thomas |
Germany |
FSP DE240416 1206
|
Automotive / Semiconductors
|
Aug 20, 2024
|
Treeby, Craig |
Australia |
FSPAU 220811 001
|
Machine Safety
|
Aug 22, 2022
|
Tremel, Chris |
USA |
FSPUSA 170406 011
|
Automotive
|
Apr 13, 2017
|
Trenkwalder, Norbert |
Germany |
FSP DE240830 604
|
Automotive
|
Oct 08, 2024
|
Trimbitas, Bogdan |
United Kingdom |
FSPGB 180110 012
|
Automotive / Semiconductors
|
Aug 30, 2019
|
Trindade, Matheus |
Germany |
FSP DE220708 105
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Trinh, Jenny |
USA |
FSPUSA 190530 005
|
SIL Verification with exSILentia
|
Jun 20, 2019
|
Trinh, Minh Nhut |
Australia |
FSPAU 220915 001
|
Machine Safety
|
Sep 19, 2022
|
Tripathi, Ankur |
India |
FSPIN191012019
|
Process
|
Oct 29, 2019
|
Tripathi, Ved |
Australia |
FSPAU 211119 005
|
Process
|
Nov 24, 2021
|
Tristanto, Gabrielia |
Australia |
FSPAU 240530 005
|
Machine Safety
|
Jun 10, 2024
|
Trivedi, Chintan |
USA |
FSPUSA 210506 001
|
Machine Safety
|
May 17, 2021
|
TRIVEDI, ASHISH N. |
India |
FSPIN220922004
|
Process
|
Oct 12, 2022
|
Trnkova, Veronika |
Slovakia |
FSPSVK 220502 001
|
Process
|
Jul 07, 2022
|
Trotskovsky, Kosta |
Israel |
FSP DE220313 801
|
Automotive - Hardware
|
Mar 28, 2022
|
Trujillo, Charlotte |
USA |
FSP USA231115001
|
Process
|
Jan 03, 2024
|
Truong Le, Michael |
Germany |
FSP DE230607 603
|
Automotive – Software
|
Jul 06, 2023
|
Tsagaanshukhert, Tuvshintugs |
Mongolia |
FSPMNG 230308 004
|
Operations & Maintenance
|
Apr 25, 2023
|
Tsagaanshukhert, Tuvshintugs |
Mongolia |
FSPMNG 230308 004
|
Process
|
May 30, 2023
|
Tsai, Ming-Hao |
Taiwan |
FSP TW170817 028
|
Process
|
Aug 25, 2017
|
Tsai, Wonder |
Taiwan |
FSPTW 221020 008
|
Automotive – Software
|
Nov 07, 2022
|
Tsai, Asa |
Taiwan |
FSPTW 221020 018
|
Automotive – Software
|
Nov 07, 2022
|
Tsang, Tony |
Canada |
FSP CA181025 009
|
Automotive / Semiconductors
|
Nov 06, 2018
|
Tsao, Ince |
Taiwan |
FSPTW 221020 019
|
Automotive – Software
|
Nov 07, 2022
|
Tsen, Gordon |
Australia |
FSPAU 190307 007
|
Machine Safety
|
Mar 24, 2019
|
Tseng, William |
France |
FSPFR 180424 005
|
Automotive / Semiconductors
|
Apr 30, 2018
|
Tseng, Orcus |
India |
FSP DE230621 613
|
Automotive - Hardware
|
Jul 06, 2023
|
Tseng, Orcus |
India |
FSP DE230621 624
|
Automotive
|
Jul 18, 2023
|
Tsogt-Erdene, Tselmeg |
Mongolia |
FSPMNG 230629 019
|
Process
|
Jul 20, 2023
|
Tu, Jiaoan |
China |
FSP CH211125 113
|
Automotive
|
May 10, 2022
|
Tu, Wen Pin |
India |
FSP DE230621 614
|
Automotive - Hardware
|
Jul 06, 2023
|
Tu, Wen Pin |
India |
FSP DE230621 622
|
Automotive
|
Jul 18, 2023
|
Tudero, Aitor |
Germany |
FSP DE240229 204
|
Automotive - Hardware
|
Mar 13, 2024
|
Tuerkoglu, Muhammed |
Germany |
FSP DE210323 603
|
Process
|
May 17, 2021
|
Tulga , Baasanjav |
Mongolia |
FSPMN 211201 014
|
Process
|
Dec 14, 2021
|
Tumurbaatar, Enkhmunkh |
Mongolia |
FSPMNG 230308 005
|
Operations & Maintenance
|
Mar 15, 2023
|
Tun, Myo Lwin |
Singapore |
FSPSG 221216 004
|
SIL Verification with exSILentia
|
Dec 26, 2022
|
Tune, Andrew |
United Kingdom |
FSPGB 180110 028
|
Automotive / Semiconductors
|
Aug 30, 2019
|
Tungalag, Javkhlantugs |
Mongolia |
FSPMNG 240113 031
|
Operations & Maintenance
|
Feb 26, 2024
|
Tuo, Shaohui |
Singapore |
FSPSG 210909 012
|
Process
|
Sep 15, 2021
|
Turato, Carlo |
Germany |
FSP DE230710 403
|
Process Industry Hardware acc. to IEC 61508
|
Feb 06, 2024
|
Turato, Carlo |
Germany |
FSP DE230711 606
|
Software Functional Safety Development
|
Feb 06, 2024
|
Turbat , Ankhbayar |
Mongolia |
FSPMN 211201 011
|
Process
|
Dec 14, 2021
|
Turley, Benjamin |
USA |
FSPUSA 210902 001
|
Machine Safety
|
Sep 13, 2021
|
Turner, Jason |
USA |
FSPUSA 151210 014
|
Process
|
Dec 15, 2015
|
Turner, Dustin |
USA |
FSPUSA 201112 005
|
SIL Verification with exSILentia
|
Nov 18, 2020
|
Twomey, Patrick |
Ireland |
FSPIRL 190617 015
|
Automotive / Semiconductors
|
Jun 19, 2019
|
TYAGI, ABHINAV |
India |
FSPIN210121002
|
Process
|
Jan 22, 2021
|
Tyrrell, Julian |
Germany |
FSP DE210923 108
|
Automotive / Semiconductors
|
Oct 20, 2021
|
Tyson, Justyna |
United Kingdom |
FSPUK 170915 008
|
Process
|
Sep 28, 2017
|
U Memon, Mughees |
United Arab Emirates |
FSPME 230614 007
|
Process
|
Aug 23, 2023
|
Uber, Clifford |
USA |
FSP 150924 004
|
Process
|
Feb 18, 2016
|
Ubhi, Sundeep |
United Kingdom |
FSPUK 180322 004
|
Process
|
Apr 04, 2018
|
Uenal, Cemrecan |
Germany |
FSP DE220802 601
|
Process
|
Feb 08, 2023
|
Ufere, Kingsley |
USA |
FSPUSA 200514 002
|
Process
|
Jun 16, 2020
|
UGARTE IMAZ, IRATI |
Spain |
FSPES 210504 014
|
Mechanical Functional Safety Development
|
May 13, 2021
|
Ughutevbe, Peter |
USA |
FSPUSA 171109 020
|
Process
|
Nov 15, 2017
|
Ujvari, Csaba |
Germany |
FSP DE231117 601
|
Automotive
|
Feb 07, 2024
|
ul Hasan, Mamun |
Germany |
FSPDE 180927 006
|
Automotive
|
Oct 12, 2018
|
Ullah, Farid |
Germany |
FSP DE210716 102
|
Automotive / Semiconductors
|
Jan 18, 2022
|
Ullah, Farid |
Germany |
FSP DE231124 104
|
Automotive / Semiconductors
|
Nov 27, 2023
|
Umapathi, NandhaKumar |
India |
FSP DE230620 608
|
Automotive – Software
|
Jul 18, 2023
|
Ünal, Bahadır |
Turkey |
FSPDE 190528 602
|
Software Functional Safety Development
|
Jun 26, 2019
|
Unal, Arif |
Germany |
FSP DE220218 201
|
Automotive - Hardware
|
Mar 08, 2022
|
Unger , Andreas |
Germany |
FSP DE231120 604
|
Automotive
|
Feb 07, 2024
|
Unithrattil Rajeevan, Rajeend |
India |
FSPIND 240529 001
|
Software Functional Safety Development
|
Jul 10, 2024
|
Unsal, Ozan |
Germany |
FSP DE220929 602
|
Automotive
|
Jan 30, 2023
|
Ünver, Muharrem |
Turkey |
FSPDE 190528 607
|
Software Functional Safety Development
|
Jun 26, 2019
|
Upadhyay, Piyush |
India |
FSPIN230209 003
|
Process
|
Mar 28, 2023
|
Upadhyay, Premkant |
USA |
FSP USA231109016
|
Software Functional Safety Development
|
Jan 03, 2024
|