Song, Linyin |
China |
FSP CH230809 906
|
Automotive / Semiconductors
|
Oct 02, 2023
|
Songyuan, Liu |
China |
FSPCN-210716-028
|
Automotive
|
Aug 03, 2021
|
Soni, Valay |
Canada |
FSPCAN 241024 014
|
Process
|
Dec 05, 2024
|
Soodeen, Veron |
Trinidad and Tobago |
FSPTTO 220408 002
|
Process
|
Aug 10, 2022
|
Sooram, Nageshwar Rao |
USA |
FSPUSA 191010 001
|
Automotive / Semiconductors
|
Oct 18, 2019
|
Sori, Sunil |
India |
FSPIN 170615 011
|
Process
|
Jun 19, 2017
|
Soupaty, Hyma |
USA |
FSPUSA 180807 001
|
Process
|
Aug 09, 2018
|
Soupaty, Hymavathi |
USA |
FSPUSA 190530 001
|
SIL Verification with exSILentia
|
Jun 20, 2019
|
Soysuren, Ismail |
Germany |
FSP DE210323 302
|
Process
|
Apr 14, 2021
|
Soysuren, Ismail |
Germany |
FSP DE210323 302
|
Process
|
Apr 20, 2021
|
Specht, Jerry |
USA |
FSPUSA 171116 002
|
Process
|
Nov 20, 2017
|
Spector, Oded |
Germany |
FSP DE221211 301
|
Process Industry Hardware acc. to IEC 61508
|
Feb 08, 2023
|
Spector, Oded |
Germany |
FSP DE230316 801
|
Process
|
Jul 06, 2023
|
Speich, Virgile |
Germany |
FSP DE221010 603
|
Automotive – Software
|
Mar 03, 2023
|
Speidel , Rainer |
Germany |
FSP 150611 005
|
Automotive
|
Jun 12, 2015
|
Sreedheran, Prasad |
United Arab Emirates |
FSPUAE 230727 010
|
Process
|
Nov 22, 2023
|
Srikantam, Vamsi |
USA |
FSPUSA 220930 008
|
Automotive / Semiconductors
|
Oct 31, 2022
|
Srinath J , Om |
India |
FSPIN 180928 006
|
Process
|
Oct 10, 2018
|
Srinivasan, Priya |
USA |
FSPUSA 191031 003
|
Process
|
Jun 16, 2020
|
Srinivasan, Premkumar |
Singapore |
FSPSG 221020 003
|
Process
|
Oct 26, 2022
|
Srinivasan, Madhumadhi |
India |
FSP DE230303 613
|
Automotive – Software
|
Jul 06, 2023
|
Srinu, Bethi |
Germany |
FSP DE221020 606
|
Automotive – Software
|
Mar 03, 2023
|
Sriprasong, Phawat |
Thailand |
FSPTH 180809 004
|
Process
|
Mar 24, 2019
|
Srivastava, Ajay |
Canada |
FSP CA181025 013
|
Automotive / Semiconductors
|
Nov 06, 2018
|
Srivastava, Govind |
India |
FSPIN220610 010
|
Process
|
Aug 03, 2022
|
Srivastava, Rajesh |
Germany |
FSP DE221001 605
|
Automotive
|
Jan 30, 2023
|
Srivastava, Ashish |
Germany |
FSP DE231122 603
|
Automotive
|
Feb 07, 2024
|
St-Yves, Stephane |
Canada |
FSPCAN240220001
|
Process
|
Apr 19, 2024
|
Stace, Donna |
Australia |
FSPAU 231019 009
|
Machine Safety
|
Jan 21, 2024
|
Stach, Kilian |
Germany |
FSP DE210305 205
|
Automotive
|
May 17, 2021
|
Stachetti, Vincent |
France |
FSP FR230713 105
|
Automotive / Semiconductors
|
Jul 26, 2023
|
Stark, Johann |
Germany |
FSP DE211115 603
|
Automotive
|
Jan 25, 2022
|
Starke, Thomas |
Germany |
FSP DE210415 602
|
Automotive – Software
|
May 17, 2021
|
Statham, Shawn |
USA |
FSPUSA 171109 018
|
Process
|
Nov 15, 2017
|
Statham , Shawn |
USA |
FSPUSA 210504 032
|
Mechanical Functional Safety Development
|
May 17, 2021
|
Statthaler, Karina |
Germany |
FSP DE211115 602
|
Automotive
|
Jan 25, 2022
|
Stecklein, Tess |
USA |
FSPUSA 220721 013
|
Process
|
Aug 10, 2022
|
Stegarescu, Marius |
Germany |
FSP DE210226 602
|
Automotive
|
Mar 24, 2021
|
Steinborsseon, Axel |
Netherlands |
FSPNLD 220408 001
|
Process
|
Apr 14, 2022
|
Steiner, Martin |
Germany |
FSP DE230324 601
|
Automotive – Software
|
Jul 06, 2023
|
Stenseth, Borgar |
Germany |
FSP DE241002 608
|
Process Industry Hardware acc. to IEC 61508
|
Dec 09, 2024
|
Stent, Andrew |
United Kingdom |
FSPUK 181206 003
|
Process
|
Dec 17, 2018
|
Stephens, Christopher |
USA |
FSPUSA 180927 010
|
Process
|
Sep 28, 2018
|
Sterling, James |
USA |
FSPUSA 151030 019
|
Automotive
|
Oct 03, 2016
|
Stevanus Chandra, Ivan |
Singapore |
FSPSG 180405 001
|
Process
|
Apr 08, 2018
|
Steven , Trev |
Australia |
FSPAU 231019 003
|
Machine Safety
|
Oct 30, 2023
|
Stevens, Matese |
USA |
FSPUSA 211119 001
|
Process
|
Dec 10, 2021
|
Steyn, Pieter |
Mongolia |
FSPMNG 230426 003
|
Process
|
May 04, 2023
|
Stiewe, Reinhard |
Germany |
FSPDE 180823 022
|
Automotive / Semiconductors
|
Aug 27, 2018
|
Stirling, Alex |
USA |
FSPUSA 240820 001
|
Process
|
Oct 15, 2024
|
Stoddard, Christian |
USA |
FSPUSA 220604 001
|
Process
|
Jul 07, 2022
|
Stokes, Luke |
Australia |
FSPAU 220811 004
|
Machine Safety
|
Aug 22, 2022
|
Stolz, Nicolaas |
Mongolia |
FSPMN 211201 002
|
Process
|
Dec 14, 2021
|
Stolzenfeld, Lindsey |
Germany |
FSP DE240411 1212
|
Automotive / Semiconductors
|
Aug 20, 2024
|
Storbeck, Gary |
USA |
FSPUSA 181108 005
|
Process
|
Nov 19, 2018
|
Strassegger-Schuster, Niclas |
Germany |
FSP DE231122 602
|
Automotive
|
Feb 07, 2024
|
Stroud, Robert |
United Kingdom |
FSPUK 210226 014
|
Process
|
Mar 16, 2021
|
Strozik, Joseph |
USA |
FSPUSA 221209 005
|
Process
|
Dec 29, 2022
|
Struck, Christian |
Germany |
FSP DE241014 602
|
Software Functional Safety Development
|
Dec 11, 2024
|
Štrukelj, Žiga |
United Kingdom |
FSPUK 210924 009
|
Process
|
Oct 01, 2021
|
Struwe, Chris |
Australia |
FSPAU 190619 010
|
Machine Safety
|
Jul 01, 2019
|
Struwe, Kim |
Germany |
FSP DE220722 301
|
Process
|
Nov 17, 2022
|
Stuber, Lionel |
USA |
FSPUSA 161215 005
|
Process
|
Dec 20, 2016
|
Styczynski, Dane |
USA |
FSPUSA 170608 003
|
Process
|
Jun 13, 2017
|
Su, Yu-Ching |
Taiwan |
FSP TW170817 024
|
Process
|
Aug 25, 2017
|
Su, Guangli |
China |
FSPCN 190614 001
|
Process
|
Jun 17, 2019
|
Su, Hong |
China |
FSP-221208-026
|
Automotive
|
Dec 20, 2022
|
Subbaraman, Ramesh |
Kuwait |
FSPME 191120 004
|
Process
|
Jan 28, 2020
|
Subirana, Ivan Rodriguez |
Bolivia |
FSPBOL 180202 001
|
Process
|
May 04, 2018
|
Subramaniam, Ranjini |
USA |
FSPUSA 170609 030
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Subramaniam, Suresh |
USA |
FSPUSA 220930 010
|
Automotive / Semiconductors
|
Oct 27, 2022
|
Subramanian, Karthik |
USA |
FSPUSA 170609 006
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Subramanian, Ganesh |
USA |
FSPUSA 170609 016
|
Automotive / Semiconductors
|
Jun 14, 2017
|
SUBRAMANIAN, SANTHOSH KUMAR |
India |
FSPIN210121004
|
Process
|
Jan 22, 2021
|
Suc, Olivier |
USA |
FSPUSA 170427 007
|
Process
|
May 02, 2017
|
Suchanek, Oliver |
Germany |
FSP DE240216 607
|
Software Functional Safety Development
|
Mar 08, 2024
|
Suchanow , Valentina |
Germany |
FSP 150611 001
|
Automotive
|
Jun 12, 2015
|
Suddamalla, Upendra |
Singapore |
FSPSG 211105 009
|
Automotive
|
Nov 14, 2021
|
Sudsawat, Kittipong |
Thailand |
FSPTH 230222 004
|
Operations & Maintenance
|
Feb 28, 2023
|
Sukhbaatar, Batchudur |
Mongolia |
FSPMNG 230629 003
|
Process
|
Jul 20, 2023
|
Suksawas, Siam |
Singapore |
FSPSG 221020 001
|
Process
|
Oct 24, 2022
|
Sulikeri, Hanumanta |
Germany |
FSP DE161214 001
|
Automotive
|
Jan 30, 2017
|
Sun, Kevin |
China |
FSPCN 160414 013
|
Process
|
Apr 27, 2016
|
Sun, Wenjing |
USA |
FSPUSA 170316 011
|
Process
|
May 24, 2017
|
Sun, Meng |
China |
FSPCN 171009 016
|
Automotive
|
Oct 10, 2017
|
Sun, Lei |
China |
FSPCN 180322 005
|
Process
|
Apr 23, 2018
|
Sun, Jianxian |
China |
FSPCN 180322 009
|
Process
|
Apr 23, 2018
|
Sun, Xiaoguang |
China |
FSPCN 180322 010
|
Process
|
Apr 23, 2018
|
Sun, Lily |
Ireland |
FSPIRL 190617 003
|
Automotive / Semiconductors
|
Jun 19, 2019
|
Sun, Yufan |
Germany |
FSP DE220726 603
|
Process
|
Nov 17, 2022
|
Sun, Peng |
China |
FSP-221208-027
|
Automotive
|
Dec 20, 2022
|
Sun, Guoshuai |
China |
FSP-221208-043
|
Automotive
|
Dec 20, 2022
|
Sun, Bolong |
China |
FSP CN230328 902
|
Automotive / Semiconductors
|
Apr 20, 2023
|
Sun, Jing |
China |
FSP CN240528 918
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Sun, Jiachen |
China |
FSP CN240528 930
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Sunal, Ayberk |
Germany |
FSP DE220803 603
|
Process
|
Feb 08, 2023
|
Sundararajan, Karthik |
USA |
FSPUSA 191010 024
|
Automotive / Semiconductors
|
Oct 18, 2019
|
Supriantno, _ |
Singapore |
FSPSG 170720 003
|
Machine Safety
|
Jan 30, 2018
|
Suram, Ragini |
USA |
FSPUS 180119 005
|
Automotive / Semiconductors
|
Feb 09, 2018
|
Surapaneni, Snigdha |
Germany |
FSP DE230327 201
|
Automotive - Hardware
|
Jul 06, 2023
|
Suryadi, Jefry |
Singapore |
FSPSG 170720 001
|
Machine Safety
|
Aug 09, 2017
|
Suryavanshi, Abhijeet |
Norway |
FSP NO220422 119
|
Automotive / Semiconductors
|
May 11, 2022
|
Suryavanshi, Abhijeet |
Germany |
FSP DE221001 602
|
Automotive
|
Feb 08, 2023
|
Suryavanshi, Abhijeet |
Germany |
FSP DE230120 605
|
Process
|
Mar 07, 2023
|
Sussman , Tim |
USA |
FSPUSA 221006 014
|
Functional Safety Development
|
Nov 14, 2022
|
Sutherland, Mark |
Australia |
FSPAU 190307 013
|
Machine Safety
|
Mar 24, 2019
|
Sutisna, AA |
Indonesia |
FSPID 220915 006
|
Operations & Maintenance
|
Sep 21, 2022
|
Sutisna, Entis Kurnia |
Indonesia |
FSPID 220915 004
|
Operations & Maintenance
|
Sep 26, 2022
|
Sutkowski, Krzysztof |
USA |
FSPUSA 200817 018
|
Functional Safety Development
|
Sep 08, 2020
|
Swamy, Mahesh |
Germany |
FSP DE221026 601
|
Automotive – Software
|
Mar 03, 2023
|
Swindle, Jacob |
USA |
FSPUSA 180809 001
|
Process
|
Aug 13, 2018
|
Swindle, Jacob |
USA |
FSPUSA 210830 001
|
SIL Verification with exSILentia
|
Sep 24, 2021
|
Syahri, Indah |
Singapore |
FSPSG 231123 004
|
Process
|
Dec 11, 2023
|
Sykes, Derek |
USA |
FSPUSA 221101 001
|
Machine Safety
|
Jan 12, 2023
|
Symonds, Ian |
United Kingdom |
FSP 160225 004
|
Process
|
Feb 29, 2016
|
Szeto, Victor |
USA |
FSPUSA 180914 004
|
Automotive / Semiconductors
|
Sep 21, 2018
|
Szewc, Kyle |
USA |
FSPUSA 230404 001
|
Software Functional Safety Development
|
Jun 09, 2023
|
Szubbocsev, Zoltan |
USA |
FSPUSA 191004 026
|
Automotive / Semiconductors
|
Oct 18, 2019
|
Szwab, Joseph |
USA |
FSPUSA 170810 008
|
Process
|
Aug 30, 2017
|
Tack, Jacon |
United Kingdom |
FSPUK 210625 005
|
Process
|
Jul 21, 2021
|
Tadros, Roudelf |
Singapore |
FSPSG 240314 004
|
Process
|
Apr 09, 2024
|
Tahara, Shinsuke |
Singapore |
FSPSG 240510 004
|
Automotive – Software
|
May 16, 2024
|
Takait, Laila |
Germany |
FSP DE220621 104
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Takata , Ryotaro |
Belgium |
FSP DE200703 116
|
ISO 26262 Automotive / Semiconductors
|
Aug 02, 2020
|
Takyrbashev, Daniiar |
USA |
FSPUSA 180216 020
|
Automotive / Semiconductors
|
Feb 20, 2018
|
Talbot, Michael |
USA |
FSP 150611 005
|
Process
|
Oct 03, 2016
|
Taleb AlAttas, Mohamed |
UAE |
FSPME 191106 014
|
Process
|
Jan 28, 2020
|
Talib, Mohammad Abdul Adib |
Singapore |
FSPSG 211118 008
|
Process
|
Nov 29, 2021
|
Tallon, Timothy |
USA |
FSPUSA 210127 009
|
Process
|
Jan 31, 2022
|
Talluto, Salvatore |
USA |
FSPUS 180119 012
|
Automotive / Semiconductors
|
Feb 09, 2018
|
Tamseel, Muhammad |
USA |
FSPUSA 191206 101
|
Process
|
Jun 16, 2020
|
Tan, Kien Beng |
Italy |
FSPIT 180504 008
|
Automotive
|
Jul 02, 2018
|
Tan, Jessica |
Singapore |
FSPSG 190314 001
|
Process
|
Mar 24, 2019
|
Tan, Cheau Kim |
Singapore |
FSPSG 190730 005
|
Process Hazard Analysis Using HAZOP
|
Aug 07, 2019
|
Tan, Chee Yong |
United Kingdom |
FSPUK 191004 003
|
Process
|
Oct 24, 2019
|
Tan, Shi Yun Jessica |
Singapore |
FSPSG 220901 001
|
Process
|
Sep 06, 2022
|
Tan, Chwan Hwang |
Singapore |
FSPSG 221208 001
|
Process
|
Dec 26, 2022
|
Tan, Shin Yi |
Malaysia |
FSPMY 221216 006
|
Automotive – Software
|
Dec 26, 2022
|
Tan, Puay Hong |
Singapore |
FSPSG 240328 007
|
Automotive
|
Apr 09, 2024
|
Tan, Chun Ming Benjamin |
Singapore |
FSPSG 240920 007
|
Process
|
Dec 09, 2024
|
Tanduo, Luca |
Italy |
FSPIT 180504 011
|
Automotive
|
Jul 02, 2018
|
Tang, Yifei |
China |
FSP 151106 004
|
Automotive
|
Nov 13, 2015
|
Tang, Spencer |
China |
FSP 151106 006
|
Automotive
|
Nov 13, 2015
|
Tang, Monica |
USA |
FSPUSA 171130 005
|
Automotive / Semiconductors
|
Dec 08, 2017
|
Tang, Yuyi |
Germany |
FSPDE 180420 005
|
Automotive / Semiconductors
|
Apr 30, 2018
|
Tang, Fee Boon |
USA |
FSPUSA 190823 001
|
Process
|
Aug 26, 2019
|
Tang, Alan Cheuk Lun |
Singapore |
FSPSG 210429 003
|
Software Functional Safety Development
|
Apr 30, 2021
|
Tang, Hua |
USA |
FSPUSA 230518 013
|
Automotive / Semiconductors
|
May 24, 2023
|
Tang, Kylie |
Australia |
FSPAU 230920 004
|
Functional Safety Development
|
Oct 09, 2023
|
Tang, Zirui |
China |
FSP CN240528 923
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Tang, Xiaodan |
China |
FSP CN240528 929
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Tangadpalliwar, Snehal |
Australia |
FSPAU 211021 005
|
Automotive
|
Feb 01, 2022
|
Tangnuntachai, Pakaporn |
Thailand |
FSPTH 241121 012
|
Process
|
Dec 09, 2024
|
Tangpatiparn, Akrawut |
Thailand |
FSPTH 241121 009
|
Process
|
Dec 09, 2024
|
Tański , Piotr |
Germany |
FSP DE161214 002
|
Automotive
|
Jan 30, 2017
|
Tanski, Piotr |
Germany |
FSP DE220317 601
|
Process
|
Apr 22, 2022
|
Tao, Wang |
China |
FSP 151106 010
|
Automotive
|
Nov 13, 2015
|
Tao, Li |
USA |
FSPUSA 180914 012
|
Automotive / Semiconductors
|
Sep 21, 2018
|
Tao, Xiong |
China |
FSP DE210717 102
|
Automotive / Semiconductors
|
Jan 18, 2022
|
Tao, Aoyun |
China |
FSP CN240528 906
|
Automotive / Semiconductors
|
Jun 21, 2024
|
Tapase, Suraj |
USA |
FSP US231109 019
|
Software Functional Safety Development
|
Dec 06, 2023
|
Taquie, Faisal |
USA |
FSPUSA 160824 004
|
Automotive
|
Sep 06, 2016
|
Tariq Al-Ibrahim, Mohammed |
Saudi Arabia |
FSPKSA 180919 004
|
Process Hazard Analysis using HAZOP
|
Jan 28, 2020
|
Taryono, Ono |
Singapore |
FSPSG 200910 007
|
Process
|
Sep 14, 2020
|
Taschwer, Christoph |
Germany |
FSP DE231119 601
|
Automotive
|
Feb 07, 2024
|
Tata, Jagati |
United Kingdom |
FSPUK 220210 008
|
Functional Safety Development
|
Mar 07, 2022
|
Tauber, Marco |
Germany |
FSP DE201126 202
|
Automotive - Hardware
|
Jan 25, 2021
|
Tawfek, Hany |
Egypt |
FSPME 191218 011
|
Process
|
Jan 28, 2020
|
Tawfik, Kamal |
Ireland |
FSPIRL 240402 004
|
Automotive
|
Jun 20, 2024
|
Tawney , Terrah |
USA |
FSPUSA 210516 004
|
Process
|
Jun 08, 2021
|
Tawney, Terrah |
USA |
FSPUSA 210516 004
|
SIL Verification with exSILentia
|
Mar 11, 2024
|
Tayal, Sumit |
USA |
FSPUS 171118 011
|
Automotive
|
Nov 27, 2017
|
Tayebi, Hooman |
Germany |
FSP DE210408 603
|
Automotive
|
May 17, 2021
|
Tayel, Ehab |
USA |
FSPUSA 181206 005
|
Process
|
Dec 17, 2018
|
Taylor, David |
USA |
FSP 150416 010
|
Process
|
May 04, 2015
|
Taylor, Robert |
USA |
FSPUSA 161215 002
|
Process
|
Dec 20, 2016
|
Taylor, Brent |
Canada |
FSP CA181025 029
|
Automotive / Semiconductors
|
Nov 06, 2018
|
Taylor, Brian |
USA |
FSPUSA 200428 101
|
Process
|
Jun 16, 2020
|
Taylor , Steven |
USA |
FSP USA 210107 001
|
Process
|
Jan 08, 2021
|
Tchoufack Teuffo, Arnaud |
Germany |
FSPDE 201015 601
|
Automotive
|
Oct 19, 2020
|
Tchoufack Teuffo, Arnaud |
Germany |
FSP DE201015 601
|
Automotive
|
Dec 11, 2020
|
Teasdale, Brent |
Singapore |
FSPSG 211118 005
|
Process
|
Nov 23, 2021
|
Tee, Erwin |
Australia |
FSPAU 221110 005
|
Machine Safety
|
Nov 24, 2022
|
Teke, Cem |
Germany |
FSP DE200925 603
|
Automotive
|
Dec 11, 2020
|
Tektaş , Musa |
Germany |
FSP DE220802 606
|
Process
|
Feb 08, 2023
|
Tempelhagen , Thilo |
Germany |
FSPDE 171213 009
|
Automotive
|
Dec 21, 2017
|
Tempero, David |
Germany |
FSP DE220325 606
|
Automotive – Software
|
Apr 20, 2022
|
Teng, Jichao |
China |
FSPCN 171009 020
|
Automotive
|
Oct 10, 2017
|
Tengda, Wang |
China |
FSPCN-210716-006
|
Automotive
|
Aug 03, 2021
|
Teperek, Robbie |
United Kingdom |
FSPUK 210326 002
|
SIL Verification with exSILentia
|
Mar 31, 2021
|
Terrell, Daniel |
USA |
FSPUSA 240503 003
|
SIL Verification with exSILentia
|
May 13, 2024
|
Terreran, Mauro |
Germany |
FSP DE230711 401
|
Process Industry Hardware acc. to IEC 61508
|
Feb 06, 2024
|
Terreran, Mauro |
Germany |
FSP DE230711 601
|
Software Functional Safety Development
|
Feb 06, 2024
|
Tey, Siu Lee |
Singapore |
FSPSG 190314 003
|
Process
|
Mar 24, 2019
|
Teyssier, Melanie |
United Kingdom |
FSPGB 180110 003
|
Automotive / Semiconductors
|
Aug 30, 2019
|
Thacker, Hiren |
India |
FSPIN180809004
|
Process
|
Aug 13, 2018
|
Thaiparambath, Bijesh |
India |
FSPIND 240320 003
|
Functional Safety Development
|
Jun 20, 2024
|
Thalabaktula, Vikas |
India |
FSP DE230302 603
|
Automotive – Software
|
Jul 06, 2023
|
Tham, Carmen |
Malaysia |
FSPMY 221216 002
|
Automotive – Software
|
Dec 26, 2022
|
Thampy, Praveen John |
Australia |
FSPAU 240829 005
|
Machine Safety
|
Sep 25, 2024
|