| Verhoeven, Rudi |
United Kingdom |
FSPUK 210924 007
|
Process
|
Oct 01, 2021
|
| Verma, Chanchal |
India |
FSPIN191012017
|
Process
|
Oct 29, 2019
|
| Verma, Archana |
India |
FSPIN210121005
|
Process
|
Jan 22, 2021
|
| Verma, Priyanka |
Germany |
FSP DE220930 606
|
Automotive
|
Jan 30, 2023
|
| Verma, Priyanka |
Germany |
FSP DE220930 607
|
Automotive
|
Feb 08, 2023
|
| Veronica, Veronica |
Singapore |
FSPSG 200910 001
|
Process
|
Sep 16, 2020
|
| Verschuere , Stefaan |
Belgium |
FSP DE200703 106
|
ISO 26262 Automotive / Semiconductors
|
Aug 02, 2020
|
| Verveyko, Alexander |
Russia |
FSPRU 210318 002
|
Functional Safety Development
|
Apr 22, 2021
|
| Vicente, Thomas |
Germany |
FSP DE220624 201
|
Automotive
|
Aug 01, 2022
|
| Vick, Donovan |
USA |
FSPUSA 221215 001
|
Process
|
Jan 24, 2023
|
| Victor Eduardo, Leon Choy |
Peru |
FSPPER 181116 004
|
Process
|
Jan 22, 2019
|
| Vidovic, Hrvoje |
Germany |
FSP DE240301 204
|
Automotive - Hardware
|
Mar 13, 2024
|
| Vielhaber, Andreas |
Canada |
FSP CA181025 012
|
Automotive / Semiconductors
|
Nov 06, 2018
|
| Vijayakumar, Minish |
India |
FSP DE230303 605
|
Automotive – Software
|
Jul 06, 2023
|
| Villa, Sara |
USA |
FSPUSA 191004 029
|
Automotive - Hardware
|
Oct 18, 2019
|
| Villa, Sara |
USA |
FSPUSA 191001 610
|
Automotive – Software
|
Oct 18, 2019
|
| Villa, Sara |
USA |
FSPUSA 191001 610
|
Automotive – Software
|
Oct 18, 2019
|
| Villa, Davide |
Germany |
FSP DE240229 207
|
Automotive - Hardware
|
Mar 13, 2024
|
| Villanueva, Jason |
Germany |
FSP DE240621 1202
|
Automotive / Semiconductors
|
Aug 20, 2024
|
| Villar, Julie |
USA |
FSPUS 180119 017
|
Automotive / Semiconductors
|
Feb 09, 2018
|
| Villegas Montes, Ángel de Jesús |
Mexico |
FSPMEX 170928 004
|
Process
|
Oct 10, 2017
|
| Villegas Sanchez, Marcelo Alejandro |
Ecuador |
FSPECU 170608 012
|
Process
|
Jun 14, 2017
|
| Villegas Villegas, Salomon |
Mexico |
FSPMEX 180524 002
|
Process
|
May 30, 2018
|
| Vincitorio, Matteo |
Italy |
FSPITL 230707 003
|
SIL Verification with exSILentia
|
Aug 15, 2023
|
| Vintis, Michael |
United Kingdom |
FSPUK 210226 002
|
Process
|
Mar 16, 2021
|
| Viquez, Carlos |
Germany |
FSP DE220222 601
|
Automotive
|
Mar 08, 2022
|
| Viswanath, Vignesh |
Germany |
FSPDE 220119 002
|
Process
|
Apr 01, 2022
|
| Viswanatha, Siva Prasad |
India |
FSPIN 170615 008
|
Process
|
Jun 19, 2017
|
| Viswanathan, Priyanka |
United Kingdom |
FSPGB 180110 020
|
Automotive / Semiconductors
|
Aug 30, 2019
|
| Vithal, Sushen |
USA |
FSPUSA 191031 004
|
Process
|
Jun 16, 2020
|
| Viti, Marco |
Italy |
FSPIT 180504 013
|
Automotive
|
Jul 02, 2018
|
| Vogel, Morgan |
USA |
FSPUSA 211016 002
|
SIL Verification with exSILentia
|
Dec 10, 2021
|
| Vogel, Sabine |
United Kingdom |
FSPUK 220616 024
|
Automotive
|
Jun 30, 2022
|
| von Staudt, Hans Martin |
Germany |
FSP DE210923 118
|
Automotive / Semiconductors
|
Oct 20, 2021
|
| Vyas, Aniket |
India |
FSPIN231012 013
|
Process
|
Nov 16, 2023
|
| Vytla, Srikanth |
Germany |
FSP DE240816 601
|
Automotive – Software
|
Dec 11, 2024
|
| W.Romdoni, Abdul |
Indonesia |
FSPID 220630 001
|
Process
|
Jul 06, 2022
|
| Wachswender, Karl |
USA |
FSPUSA 230518 001
|
Automotive / Semiconductors
|
May 24, 2023
|
| Wagener, Richard |
United Kingdom |
FSPUK 220616 012
|
Automotive
|
Jun 30, 2022
|
| Wagh, Vinod |
India |
FSPIN190124001
|
Process
|
Sep 06, 2019
|
| Waghela, Neelesh |
India |
FSP DE230621 605
|
Automotive - Hardware
|
Jul 06, 2023
|
| Waghmare, Sandip |
United Arab Emirates |
FSPME 230614 005
|
Process
|
Aug 23, 2023
|
| Wagner, Pilar |
Germany |
FSP DE210217 602
|
Automotive – Software
|
Mar 02, 2021
|
| Wahab, Sarmad |
Germany |
FSP DE210718 101
|
Automotive / Semiconductors
|
Jan 18, 2022
|
| Waidacher, Lukas |
Germany |
FSP DE231122 604
|
Automotive
|
Feb 07, 2024
|
| Wainwright, Richard |
USA |
FSPUSA 170406 010
|
Automotive
|
Apr 13, 2017
|
| Wakefield, Ylva |
Australia |
FSPAU 230216 001
|
Process
|
Mar 03, 2023
|
| Waldstein, Steven |
Canada |
FSP CA181025 016
|
Automotive / Semiconductors
|
Nov 06, 2018
|
| Walker, Laura |
United Kingdom |
FSPUK 210226 005
|
Process
|
Mar 16, 2021
|
| Walker, Natalka |
Australia |
FSPAUS 240918 005
|
Functional Safety Development
|
Nov 07, 2024
|
| Wallace, Mark |
USA |
FSPUSA 151030 013
|
Automotive
|
Oct 03, 2016
|
| Wallace, Don |
USA |
FSPUSA 221006 016
|
Functional Safety Development
|
Oct 27, 2022
|
| Wallis, Michael |
Singapore |
FSPSG 241128 007
|
Process
|
Dec 09, 2024
|
| Walls, Kim |
USA |
FSPUSA 220721 008
|
Process
|
Jul 26, 2022
|
| Walsdorf, Rainer |
Germany |
FSP DE180620 011
|
Automotive – Software
|
Jul 11, 2018
|
| Walsh, Hugh |
Germany |
FSPDE 180420 002
|
Automotive / Semiconductors
|
Apr 30, 2018
|
| Wan, Shiyuan |
China |
FSPCN 190221 005
|
Process
|
Mar 24, 2019
|
| Wang, YuTao |
China |
FSP 151106 016
|
Automotive
|
Nov 13, 2015
|
| Wang, Xuemei |
China |
FSPCN 160519 002
|
Process
|
May 31, 2016
|
| Wang, Mark |
USA |
FSPUSA 160825 018
|
Automotive
|
Sep 06, 2016
|
| Wang, Howard |
USA |
FSPUSA 170609 014
|
Automotive / Semiconductors
|
Jun 14, 2017
|
| Wang, Yi-Ming |
Taiwan |
FSP TW170817 025
|
Process
|
Aug 25, 2017
|
| Wang, Xichun |
China |
FSPCN 171009 005
|
Automotive
|
Oct 10, 2017
|
| Wang, Zongyin |
China |
FSPCN 171009 006
|
Automotive
|
Oct 10, 2017
|
| Wang, Tan |
China |
FSPCN 171009 015
|
Automotive
|
Oct 10, 2017
|
| Wang, Yongjun |
China |
FSPCN 180322 003
|
Process
|
Apr 23, 2018
|
| Wang, Robin |
China |
FSPCN 181207 027
|
Automotive / Semiconductors
|
Dec 21, 2018
|
| Wang, Liping |
China |
FSPCN 190221 006
|
Process
|
Mar 24, 2019
|
| Wang, Dong |
China |
FSPCN 191205 002
|
Process
|
Dec 08, 2019
|
| Wang, Zhi Peng |
China |
FSPCN-20201030-003
|
Automotive
|
Nov 09, 2020
|
| Wang, Rock |
USA |
FSP USA 201119 002
|
Process
|
Nov 24, 2020
|
| Wang, Siwei |
Shanghai |
FSP CN220326 002
|
Automotive / Semiconductors
|
Apr 06, 2021
|
| Wang, Xuan |
USA |
FSPUSA 210301 012
|
Process
|
Apr 06, 2021
|
| Wang, Xin |
China |
FSP CN191204 003
|
Automotive / Semiconductors
|
Jun 07, 2021
|
| Wang, Jie |
Singapore |
FSPSG 210909 010
|
Process
|
Sep 12, 2021
|
| Wang, Chunting |
China |
FSP CN 211229 004
|
Automotive
|
Jan 11, 2022
|
| Wang, Jack |
United Kingdom |
FSPUK 211216 004
|
Process
|
Apr 20, 2022
|
| Wang, Ting |
China |
FSP CH211125 107
|
Automotive
|
May 10, 2022
|
| Wang, Yubo |
China |
FSP CH211125 109
|
Automotive
|
May 10, 2022
|
| Wang, Xiaoming |
China |
FSP CH211125 110
|
Automotive
|
May 10, 2022
|
| Wang, Jianxia |
China |
FSP CH211125 124
|
Automotive
|
May 10, 2022
|
| Wang, Zhengpu |
China |
FSPCN 220901 002
|
Automotive
|
Oct 27, 2022
|
| Wang, Yuxiu |
China |
FSPCN 220901 011
|
Automotive
|
Oct 27, 2022
|
| Wang, Wayne |
Taiwan |
FSPTW 221020 012
|
Automotive – Software
|
Nov 07, 2022
|
| Wang, Han |
USA |
FSPUSA 221209 003
|
Process
|
Dec 13, 2022
|
| Wang, Hao |
China |
FSP-221208-009
|
Automotive
|
Dec 20, 2022
|
| Wang, Xinran |
China |
FSP-221208-015
|
Automotive
|
Dec 20, 2022
|
| Wang, Jiarui |
China |
FSP-221208-018
|
Automotive
|
Dec 20, 2022
|
| Wang, Zhe |
China |
FSP-221208-028
|
Automotive
|
Dec 20, 2022
|
| Wang, Zhaoxue |
China |
FSPCN 221220 003
|
Hardware Functional Safety Development
|
Dec 26, 2022
|
| Wang, Wei |
China |
FSP CN230809 904
|
Automotive / Semiconductors
|
Oct 02, 2023
|
| Wang, Yingwei |
China |
FSP CN231222 905
|
Automotive / Semiconductors
|
Jan 15, 2024
|
| Wang, Chenhao |
China |
FSP CN240528 914
|
Automotive / Semiconductors
|
Jun 21, 2024
|
| Wang, Simin |
China |
FSP CN240528 919
|
Automotive / Semiconductors
|
Jun 21, 2024
|
| Wang, Grace (Hui-Chieh) |
Germany |
FSP DE240805 603
|
Automotive – Software
|
Dec 11, 2024
|
| Wang, Melissa |
Germany |
FSP DE240805 602
|
Automotive – Software
|
Dec 11, 2024
|
| Wanlin, Wang |
China |
FSPCN-210716-014
|
Automotive
|
Aug 03, 2021
|
| Waqas , Muhammad |
United Kingdom |
FSPUK 181206 012
|
Process
|
Dec 17, 2018
|
| Ward, Gregory |
Australia |
FSPAUS 220725 002
|
Operations & Maintenance
|
Aug 10, 2022
|
| Warke, Nilima |
India |
FSPIN190124011
|
Process
|
Sep 06, 2019
|
| Wartenberg, Sven |
Germany |
FSP DE230327 205
|
Automotive - Hardware
|
Jul 06, 2023
|
| Wartenberg, Sven |
Germany |
FSP DE230327 601
|
Automotive – Software
|
Jul 06, 2023
|
| Waterman, Derrick |
USA |
FSPUSA 211208 012
|
Process
|
Jan 12, 2023
|
| Waterman, Derrick |
USA |
FSPUSA 230928 010
|
Process
|
Oct 02, 2023
|
| Watson, Ben |
USA |
FSPUSA 190606 017
|
Functional Safety Development
|
Jun 19, 2019
|
| Watson, Gavin |
USA |
FSP USA231213006
|
Process
|
Jan 03, 2024
|
| Wauthier, Scott |
USA |
FSPUSA 151030 022
|
Automotive
|
Oct 03, 2016
|
| Waxter, Danielle |
USA |
FSPUSA 211022 002
|
Functional Safety Development
|
Nov 24, 2021
|
| Wayper, Mark |
United Kingdom |
FSPUK 210326 009
|
SIL Verification with exSILentia
|
Apr 06, 2021
|
| Webb, Holly |
Australia |
FSPAU 190307 004
|
Machine Safety
|
Mar 24, 2019
|
| Weber, Peter |
Germany |
FSP DE180706 003
|
Automotive – Software
|
Jul 11, 2018
|
| Weber, Matt |
USA |
FSPUSA 2208 22 006
|
Process
|
Nov 23, 2022
|
| Weber, Robin |
Germany |
FSP DE231207 401
|
Process Industry Hardware acc. to IEC 61508
|
Feb 07, 2024
|
| Weber, Rich |
Germany |
FSP DE240416 1201
|
Automotive / Semiconductors
|
Aug 20, 2024
|
| Webster, Curtis |
Canada |
FSP CA181025 010
|
Automotive / Semiconductors
|
Nov 06, 2018
|
| Webster, Brent |
Australia |
FSPAU 220721 013
|
Machine Safety
|
Aug 01, 2022
|
| Weel, Toby |
Australia |
FSPAU 230216 006
|
Process
|
Feb 27, 2023
|
| Ween, Jarrad |
Australia |
FSPAUS 220725 011
|
Operations & Maintenance
|
Jul 29, 2022
|
| Wegerer, Katja |
Germany |
FSP DE210409 605
|
Automotive
|
May 17, 2021
|
| Wegrzyn, Robert |
USA |
FSPUSA 151030 014
|
Automotive
|
Oct 03, 2016
|
| Wehland, Timothy |
USA |
FSPUSA 180927 011
|
Process
|
Sep 28, 2018
|
| Wehner, Steffen |
Germany |
FSP DE230623 601
|
Automotive – Software
|
Jul 18, 2023
|
| Wei, Zhang |
China |
FSP 150923 012
|
Automotive
|
Sep 28, 2015
|
| Wei, Xingjun |
China |
FSPCN 160414 003
|
Process
|
Apr 27, 2016
|
| Wei, Bensheng |
China |
FSPCN 180322 012
|
Process
|
Apr 23, 2018
|
| Wei, Wang |
China |
FSPCN-210716-032
|
Automotive
|
Aug 03, 2021
|
| Wei, Ding |
China |
FSPCN-210716-013
|
Automotive
|
Aug 03, 2021
|
| Wei, Zhong |
Germany |
FSP DE210916 103
|
Automotive / Semiconductors
|
Oct 07, 2021
|
| Wei, Ma |
Germany |
FSP DE210916 114
|
Automotive / Semiconductors
|
Oct 07, 2021
|
| Wei, Liu |
Germany |
FSP DE210916 119
|
Automotive / Semiconductors
|
Oct 07, 2021
|
| Wei, Cheng |
China |
FSPCN-220803-014
|
Automotive
|
Aug 03, 2022
|
| Wei, Yao |
China |
FSPCN-220803-024
|
Automotive
|
Aug 03, 2022
|
| Wei, Richard |
China |
FSP-221208-020
|
Automotive
|
Dec 20, 2022
|
| Wei, Ran |
China |
FSP-221208-033
|
Automotive
|
Dec 20, 2022
|
| Wei, Lin |
China |
FSPCN-230221-003
|
Automotive
|
Mar 16, 2023
|
| Wei, Huang |
China |
FSPCN-230221-017
|
Automotive
|
Mar 16, 2023
|
| Weijie, Chen |
China |
FSP 150923 006
|
Automotive
|
Sep 28, 2015
|
| Weijie, Weijie |
Shanghai |
FSP CN220326 001
|
Automotive / Semiconductors
|
Apr 09, 2021
|
| Weijie, Wang |
China |
FSPCN-210722-018
|
Automotive
|
Aug 03, 2021
|
| Weinberger, Robert |
USA |
FSPUSA 230623 001
|
Functional Safety Development
|
Jun 27, 2023
|
| Weiner, Michael |
United Kingdom |
FSPGB 180110 011
|
Automotive / Semiconductors
|
Aug 30, 2019
|
| Weisman, Eric |
USA |
FSPUSA 180216 006
|
Automotive / Semiconductors
|
Feb 20, 2018
|
| Weiss, Josh |
Australia |
FSPAUS 220527 004
|
Machine Safety
|
Jun 17, 2022
|
| Welborn, William |
USA |
FSPUSA 100515 002
|
Process
|
Jul 16, 2021
|
| Wells, Aaron |
Germany |
FSP DE240726 603
|
Automotive – Software
|
Dec 11, 2024
|
| Wen, Tao |
China |
FSPCN 160519 003
|
Process
|
May 31, 2016
|
| Weng, Yusheng |
China |
FSPCN 221017-025
|
Automotive
|
Oct 27, 2022
|
| Wenping, Lv |
China |
FSPCN-210716-025
|
Automotive
|
Aug 03, 2021
|
| Wenyuan, Bao |
China |
FSPCN-230221-009
|
Automotive
|
Mar 16, 2023
|
| Wenzel, Martin |
Germany |
FSP DE201022 105
|
Automotive/Semiconductors
|
Nov 03, 2020
|
| Werner , Claire |
United Kingdom |
FSPUK 170914 0003
|
Process
|
Sep 15, 2017
|
| Werner, Claire |
United Kingdom |
FSPUK 170915 005
|
Process
|
Sep 28, 2017
|
| Werner, Maximilian |
Germany |
FSP DE210315 202
|
Automotive - Hardware
|
May 17, 2021
|
| Werner, Maximilian |
Germany |
FSP DE210416 605
|
Automotive – Software
|
May 17, 2021
|
| Werner, Philipp |
Germany |
FSP DE231129 602
|
Automotive
|
Feb 07, 2024
|
| West, Basil |
Trinidad and Tobago |
FSPTT 160922 015
|
Process
|
Oct 12, 2016
|
| Westerdale, Gary |
USA |
FSPUSA 210301 016
|
Process
|
Apr 16, 2021
|
| Westerhout, Brendon |
Australia |
FSPAU 190307 008
|
Machine Safety
|
Mar 24, 2019
|
| Westrup, Lukas |
USA |
FSPUSA231214007
|
SIL Verification with exSILentia
|
Mar 08, 2024
|
| Wetterlin, Rachel |
USA |
FSPUSA 220902 001
|
Process
|
Dec 13, 2022
|
| Wex, Florian |
Germany |
FSPDE 180823 008
|
Automotive / Semiconductors
|
Aug 27, 2018
|
| Wheeler, Jeff |
USA |
FSPUSA 170309 001
|
Process
|
Mar 24, 2017
|
| Wheeler, Ian |
USA |
FSPUSA 191004 024
|
Automotive / Semiconductors
|
Oct 18, 2019
|
| Whelan, Rian |
India |
FSP DE230303 601
|
Automotive – Software
|
Jul 06, 2023
|
| Whicker, Tim |
USA |
FSPUSA 171116 011
|
Process
|
Nov 20, 2017
|
| Whitaker, Shea |
USA |
FSPUSA 210301 004
|
Process
|
Mar 29, 2021
|
| Whitaker, Shea |
USA |
FSPUSA 210301 004
|
Operations & Maintenance
|
Sep 24, 2021
|
| Whitaker, Shea |
USA |
FSPUSA 210301 004
|
HAZOP Facilitation
|
Jun 17, 2022
|
| Whitaker, Shea |
USA |
FSPUSA 210301 004
|
SIL Verification with exSILentia
|
Jun 22, 2022
|
| White, Mary Ann |
USA |
FSPUS 180119 001
|
Automotive / Semiconductors
|
Feb 09, 2018
|
| White, Julie |
USA |
FSPUSA 180322 012
|
Process
|
May 08, 2018
|
| White, Corbin |
USA |
FSPUSA 240503 002
|
SIL Verification with exSILentia
|
May 13, 2024
|
| Whitelaw, Kevin |
USA |
FSPUSA 161208 014
|
Process
|
Aug 24, 2017
|
| Whitelaw, Kevin |
USA |
FSPUSA 161208 014
|
Machine Safety
|
Jan 12, 2018
|
| Wichayawanich, Pipatpol |
Thailand |
FSPTH 230222 003
|
Operations & Maintenance
|
Mar 27, 2023
|
| Wicke, Matthew |
USA |
FSPUSA 230623 006
|
Functional Safety Development
|
Jun 27, 2023
|
| Wieland, Friedrich |
Germany |
FSP DE201125 201
|
Automotive - Hardware
|
Jan 25, 2021
|
| Wikstroem, Juha |
Norway |
FSP NO220422 106
|
Automotive / Semiconductors
|
May 11, 2022
|
| Wiley, Edward |
USA |
FSPUSA 151030 015
|
Automotive
|
Oct 03, 2016
|
| Wilfling, Hannes |
Germany |
FSP DE240903 603
|
Automotive
|
Oct 08, 2024
|
| Wilke, Jens |
Germany |
FSP DE180706 004
|
Automotive – Software
|
Jul 11, 2018
|
| Wilkes, Ron |
USA |
FSPUSA 161208 005
|
Process
|
Dec 13, 2016
|
| Williams, Stewart |
USA |
FSPUSA 191010 003
|
Automotive / Semiconductors
|
Oct 18, 2019
|
| Williams, Luke |
USA |
FSPUSA 210701 001
|
Process
|
Oct 06, 2021
|
| Williams, Ryan |
United Kingdom |
FSPUK 211216 007
|
Process
|
Dec 20, 2021
|
| Williams-Oyenigba, Robert |
United Kingdom |
FSPUK 181206 013
|
Process
|
Dec 17, 2018
|
| Willms, Manuel |
Germany |
FSP DE210305 204
|
Automotive
|
May 17, 2021
|
| Wilson, Ian |
Australia |
FSPAUS 220727 011
|
Automotive
|
Aug 26, 2022
|
| Wilson, Melanie |
Papua New Guinea |
FSPPG 230721 012
|
Process
|
Aug 15, 2023
|
| Wilson, Blaise |
United Kingdom |
FSPUK 240402 003
|
Functional Safety Development
|
May 13, 2024
|
| Winefeld, Benny |
USA |
FSPUSA 171130 023
|
Automotive / Semiconductors
|
Dec 08, 2017
|
| Winkelmuller, Etienne |
Germany |
FSPDE 230424 001
|
Automotive / Semiconductors
|
May 12, 2023
|
| Winn, Samantha |
USA |
FSPUSA 220721 014
|
Process
|
Aug 10, 2022
|
| Winni, Valentina |
Singapore |
FSPSG 191031 004
|
Functional Safety Development
|
Nov 11, 2019
|
| Wint, YeeHnin |
Singapore |
FSPSG 191031 007
|
Functional Safety Development
|
Nov 11, 2019
|
| Winter, Martin |
Germany |
FSPDE 181026 003
|
Automotive
|
Dec 06, 2018
|
| Wipoosanawan, Wattanapong |
Thailand |
FSPTH 241121 008
|
Process
|
Dec 09, 2024
|
| Wirsig, Maximilian |
Germany |
FSPDE 170629 006
|
Automotive
|
Jul 17, 2017
|
| Wisdom, Charles |
USA |
FSPUSA 170316 006
|
Process
|
Apr 03, 2017
|
| Withell, Dylan |
Australia |
FSPAUS 231023 002
|
Automotive
|
Nov 14, 2023
|
